Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 41 for “"electronics cooling"”.
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Two-dimensional thermoelectric transport for electronics cooling
This Dissertation was approved for publication on 2024-11-07 at 17:55.
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Electrohydrodynamic Microfabricated Ionic Wind Pumps for Electronics Cooling Applications
… demonstrates an innovative microfabricated air cooling technology that employs an electrohydrodynamic (EHD) corona discharge or ionic wind pump that has the potential to meet industry requirements as a next generation solution for thermal management applications. A single ionic wind pump element …
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Transient thermal phenomena in phase change material integrated electronics cooling
Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2026-12-01
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Liquid-vapor phase change phenomena for heat exchangers and electronics cooling
… evaporation of these droplets can provide a cooling mechanism for small electronics components at high flux. Demand for enhanced cooling technologies within various commercial and consumer applications has increased in recent decades due to electronic devices becoming more energy dense. In …
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Design and optimization of single-phase liquid cooled heat exchangers for electronics cooling
Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2025-12-01
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Experimental Evaluation of an Additively Manufactured Straight Mini-Channel Heat Sink for Electronics Cooling
… generation has challenged conventional air fan cooling and alternative solutions for heat removal are required to avoid overheating and part damage. Micro/Mini channel heat sinks (M/MCHS) that use liquids for heat removal appear as an attractive solution to this problem as they provide large …
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Heat transfer via dropwise condensation on hydrophobic microstructured surfaces
… many heat exchange applications, particularly electronics cooling.
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Development and assessment of a physics-based model for subcooled flow boiling with application to CFD
… power systems in general and, more recently, in electronics cooling. Physics-based models that describe boiling heat transfer, when coupled with Computational Fluid Dynamics (CFD), can be an invaluable tool to increase the performance of such systems. Existing modeling approaches do not …
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Performance analysis of the air-moving capabilities of piezoelectric fan arrays
… studied and most applications are focused on electronics cooling. However, for applications requiring higher pressures and flow rates piezoelectric fans have not been considered. This study is aimed at improving the performance by implementing an array of piezoelectric fans. A performance …
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Decreasing the Power Consumption of Hybrid Electric Vehicle Architectures
… for improvement are aerodynamics and passive cooling of electrical systems. Aerodynamics of an Ahmed body is investigated with a drag reduction system proposed utilizing slot jets at the rear of the bluff body . Two separate systems show a decrease in drag of 16 and 25%. The paper also …
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Enhancement of nucleate boiling heat transfer by surface modification in a cold plate evaporator
Electronics cooling applications have very high local heat fluxes, which allow for significant improvement of heat transfer by different methods. This thesis focuses on improving boiling heat transfer by surface modification with R134a in a microchannel cold plate evaporator. Internal copper and …
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Development and application of low Reynolds number turbulence models for air-cooled electronics
… more and more challenging to design. Air cooling of electronic components is the preferred method for many designs where the air flow is characterised as being in the laminar-to-turbulent transitional region. Over the last fifteen years there has been a dramatic take-up of Computational …
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Desktop systems for manufacturing carbon nanotube films by chemical vapor deposition
… transform such diverse fields as composites, electronics, cooling, energy storage, and biological sensing. For the United States Navy, composites potentially provide a significant decrease in lifetime maintenance costs of ships by eliminating hull corrosion. A stronger composite could also …
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Study of Surface Tension, Natural Evaporation, and Subcooled Boiling Evaporation of Aqueous Surfactant Solutions
… devices, such as pulsating heat pipes used for electronics cooling. Some surfactants have been shown to lower thermal resistances and friction pressure in such devices and thereby increase their efficiency.</p>
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Multiphase Microfluidics for Convective Heat Transfer and Manufacturing
… biological and chemical micro-reactors, and electronics cooling. First, fluid-fluid interfaces can be used for the generation of particles. At the interface between two fluids in motion, instabilities can occur. One reason for these instabilities is the difference in shear velocities which …
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The development of a new compact model for prediction of forced flow behaviour in longitudinal fin heat sinks with tip bypass
… and chip densities in the rapidly evolving electronics cooling industry are causing an ever increasing need for the tools and methods necessary for electronic systems design and optimisation. Modern electronic systems have the capacity to produce significant amounts of heat which, if not …
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Thermal management of discretized heaters using CuW microchannel heat sinks and FC3283 for laser diode applications
Single-phase cooling using microchannel heat sinks (MCHS) has become a popular approach for overcoming the thermal challenges associated with high-powered microelectronic devices. Thermal management is one of the largest barriers to higher power densities in electronics and frequently limits …
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Numerical and experimental investigation of composite heat pipe technology
… applications, such as power generation, electronics cooling, and permafrost retention. To improve specific (per unit mass) performance and reduce manufacturing cost, we present here a concept for a composite heat pipe that utilizes different materials for the adiabatic and …
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Flow and Heat Transfer in Microchannels 30 to 300 Microns in Hydraulic Diameter
… thermal systems, compact heat exchangers and electronics cooling. The purpose of this investigation is to contribute to this new research area through carefully designed and well controlled experimental work. Experiments were performed to characterize single-phase and two-phase flow pressure …
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Developing an active, high-heat-flux thermal management strategy for power electronics via jumping-droplet phase-change cooling
… work presents the first demonstration of active cooling for hot spots in compact electronics via electric-field-enhanced (EFE) jumping-droplet condensation. To test the viability of EFE condensation for electronic hot spot cooling, an experimental setup was developed to remove heat via droplet …
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