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Showing 1 to 1 of 1 for “"drying of silver paste"”.
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A diffusion-viscous analysis and experimental verification of the drying behavior in nanosilver-enabled low-temperature joining technique
The low-temperature joining technique (LTJT) by silver sintering is being implemented by major manufacturers of power electronics devices and modules for bonding power semiconductor chips. A common die-attach material used with LTJT is a silver paste consisting of silver powder (micron- or …