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Showing 1 to 14 of 14 for “"double-sided cooling"”.
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Integrated Thermal Management Strategies for Embedded Power Electronic Modules
… techniques to assess fundamental and practical cooling limitations on IPEMs, developing both passive and active integrated thermal management strategies, and creating design guidelines for IPEMs based on both thermal and thermo-mechanical stress considerations. Specifically, a commercially …
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Medium voltage extreme fast charger based on novel medium voltage SiC power devices
… ensured by a novel variable switching frequency double phase shift modulation technique. Experimental results validate the simulation results and show a high efficiency of 98%. A novel and improved 4.5kV SiC Austin SuperMOS half-bridge module with double-sided cooling and ultra-low stray …
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Design and Optimization of Multichip GaN Module Enabling Improved Switching Performance
… available easy 1B package and have a single-sided cooling feature. In the second or advanced design, a new design has been proposed with similar loop inductance but double-sided cooling feature and better EMI performance.</p> <p>Moreover, to address the near field coupling issue in a …
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Reliability Evaluation of Large-Area Sintered Direct Bonded Aluminum Substrates for Medium-Voltage Power Modules
… stacked DBA substrates. Finally, analysis of a double-sided cooling scheme enabled by large area sintering is simulated and prototyped to demonstrate a 6.5 kV package for a MV power device. Residual stress failures induced by a highly rigid structure have been examined and mitigated through …
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Multifaceted Codesign for an Ultra High-Density, Double-Sided Cooled Traction Inverter Half Bridge Module
… time below 20 ns. The proposed module features a double-sided cooling sandwiched structure, an integrated thermistor for health and degradation monitoring, and incorporates three Wolfspeed 3rd generation 1.7 kV, 18 mΩ devices per switch position. The simulated power loop inductance is 14.5 nH, the …
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Experimentally validated multiscale thermal modeling of electronic cabinets
… cabinet and the test vehicle with hybrid cooling technique. The latter incorporated double-sided cooling with hybrid forced air convection, thermoelectric cooling, and micro-channel liquid cooling. The overall multi-scale modeling framework was able to reduced numerical models containing …
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Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
… of a wire bond module. Under the same single-sided cooling conditions, thermal modeling results show a significantly lower junction temperature of 17oC in the MPIPPS module than that in the wire bond module, due to the more uniform heat flow distribution in the MPIPPS module. The top DBC …
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A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer
… well as to provide both vertical and horizontal cooling paths to maximize heat dissipation. The proposed 3-D power module package was designed, simulated, fabricated and tested. In this module, low temperature co-fired ceramic (LTCC) substrate with vias is utilized as an interposer of which both …
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Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Technology
… and interconnection requirements. Advanced cooling schemes, such as double-sided, forced liquid convection or multi-phase flow, can be implemented with non-wire bond packaging to improve thermal management while maintaining proper electrical performance. Embedded power is one such packaging …
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Field-Grading in Medium-Voltage Power Modules Using a Nonlinear Resistive Polymer Nanocomposite Coating
… the latest packaging techniques, including double-sided cooling and silver-sintering. Prototypes of 10-kV and 20-kV silicon carbide diode modules confirmed the practicality and efficacy of the polymer nanocomposite. The insulation enhancements observed at the module level mirrored those at …
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Optimization and Fabrication of Heat Exchangers for High-Density Power Control Unit Applications
… to increase significantly. However, the overall cooling system has remained unchanged and only the heat exchanger corresponding to the power control unit (PCU) has been improved. This has allowed the manufacturing costs to go down. Efforts are constantly being made to reduce the PCU size even …
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Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules
… Embedded Power modules, and investigate various cooling strategies for the Embedded Power modules. Validated thermal models were used for various thermal analyses including identifying potential thermal problems, recognizing critical thermal design parameters, and exploring different integrated …
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Packaging of a High Power Density Point of Load Converter
… embeds the devices in the substrate to give double sided cooling capabilities. This fabrication goes away from traditional photoresist and solder-masking techniques and simplifies the entire process so that it can be transferred to industry. Time consuming sputtering and electroplating …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
… external interconnections, such as leadframe. Double-sided cooling is realized in these CSPs. Temperature cycling test shows that the CSPs are reliable. Integrated power electronics modules (IPEMs) are envisioned as integrated power modules consisting of power semiconductor devices, power …