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Showing 1 to 10 of 10 for “"double pulse test"”.

  1. A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer

    … package was designed, simulated, fabricated and tested. In this module, low temperature co-fired ceramic (LTCC) substrate with vias is utilized as an interposer of which both top and bottom sides are used as die attachment surfaces, the SiC MOSFET bare dies are flip-chip attached on the LTCC …

    arkansas Repository record for A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer (opens in a new tab)

  2. Gating Methods for High-Voltage Silicon Carbide Power MOSFETs

    … for the experimental setup using the double pulse test (DPT) is also discussed. Conclusions are made based on the performance of the device under multi-level turn-off, and future considerations for enabling the next generation high-voltage SiC MOSFETs are discussed. </p>

    arkansas Repository record for Gating Methods for High-Voltage Silicon Carbide Power MOSFETs (opens in a new tab)

  3. Gallium Nitride Power Electronics using Machine Learning

    … of the model is validated using simulation and double pulse test experiments at 450 V, 10 A test conditions. The developed behavioural model for Transhporm GaN HEMT is 95.2% accurate as the existing LT-spice manufacturer model, and is very much easier for power designers to handle, without the …

    cambridge

  4. Experimental Evaluation of Medium-Voltage Cascode Gallium Nitride (GaN) Devices for Bidirectional DC–DC Converters

    … GaN power devices are examined through the double-pulse test (DPT) at different gate resistance values, device currents, and DC-bus voltages. Furthermore, the switching behavior and energy loss as well as the rate of voltage and current changes over the time are studied and analyzed at …

    denver Repository record for Experimental Evaluation of Medium-Voltage Cascode Gallium Nitride (GaN) Devices for Bidirectional DC–DC Converters (opens in a new tab)

  5. Static and Dynamic Characterization of Silicon Carbide and Gallium Nitride Power Semiconductors

    … of the devices are conducted by performing the double-pulse test. The switching characteristics are also tested at high temperature, with the presented results putting an emphasis on one of the devices. A comparison of the key characterization results summarizes the performance of the different …

    vt Repository record for Static and Dynamic Characterization of Silicon Carbide and Gallium Nitride Power Semiconductors (opens in a new tab)

  6. Gate Driver for Phase Leg of Parallel Enhancement-Mode Gallium-Nitride (GaN) Transistors

    … in the worst case, 500 ns, during a shortcircuit test. The phase leg survived a series of shortcircuit tests with shortcircuit protection. For the proposed protection scheme, the best-case reaction time (200 ns) is similar to others in the literature, while the shortcircuit peak current and peak …

    vt Repository record for Gate Driver for Phase Leg of Parallel Enhancement-Mode Gallium-Nitride (GaN) Transistors (opens in a new tab)

  7. GaN-Based High-Efficiency, High-Density, High-Frequency Battery Charger for Plug-in Hybrid Electric Vehicle

    … and output charge are characterized. In a double pulse test, GaN devices show fast switching speed. The loss estimation based on the characterization results shows a good match with the measurement results of a 500 kHz GaN-based boost converter. Topology selection is conducted to identify …

    vt Repository record for GaN-Based High-Efficiency, High-Density, High-Frequency Battery Charger for Plug-in Hybrid Electric Vehicle (opens in a new tab)

  8. Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints

    … voltage rating of bare dies. Modules were also tested up to the rated current (150 A) and half of the rated voltage (600 V), which were the test conditions in the datasheet for commercial modules with the same voltage and current ratings. I-V characteristics of packaged devices were similar …

    vt Repository record for Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints (opens in a new tab)

  9. Unlocking SiC MOSFET Switching Performance Through Packaging and Instrumentation

    … a large stray inductance into the circuit under test. Insufficient bandwidth can slew the measured rise-time of the switching edge leading to incorrect switching loss measurement and can attenuate high-frequency resonances reducing their apparent severity. A distorted bandwidth can significantly …

    cambridge Repository record for Unlocking SiC MOSFET Switching Performance Through Packaging and Instrumentation (opens in a new tab)