Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 14 of 14 for “"direct-bonding"”.
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Optimization of surface preparation technique for unipolar silicon direct bonding
A special wafer bonding method called the Silicon Direct Bonding technique is used to study the bonding of unipolar (n-type, <100> oriented) silicon wafers. The primary objective of this thesis project is to find an optimum surface preparation technique for subsequent silicon wafer bonding. Wafer …
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Clinical Acceptability of Digital Indirect Bonding Compared to Direct Bonding by Varying Orthodontic Experience: Pilot Study
… orthodontic bracket placement between digital indirect and direct bonding techniques and between participants with three levels of varying orthodontic experience (dental students, orthodontic residents, experienced orthodontists) using one intervention model. The percentage of clinically …
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Novel active waveguide devices in direct-bonded structures
… a series of experimental studies on the use of direct bonding for optical waveguide fabrication. The direct bonding technique involves contacting two ultra-clean polished surfaces to form an adhesive-free vacuum-tight bond. Optical materials bonded in this way can be formed into waveguide …
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Multi-Watt, diode-pumped planar waveguide lasers
… epitaxy (LPE), pulsed laser deposition (PLD) and direct bonding, were investigated. A Nd:GGG on YAG waveguide fabricated by PLD was found to have a loss <0.5dB/cm, the lowest so far reported for a PLD layer. The waveguide lased on the four-level laser transition at around 1µm and, for the first …
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Micro-transfer print integration of high-speed photodetectors to SOI platform
… layers (InGaAs or AlInAs). This facilitates direct bonding of the PD coupons to the target wafer since the interface roughness is extremely low as 0.2 nm over an area of 10 µm x 10 µm, contributing to high-speed of the PD. An excellent selectivity of 5410 is obtained with InP, which is 3.4 …
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Optical Frequency Domain Reflectometry Based Quasi-distributed High Temperature Sensor
Temperature sensing in harsh environment is desired in many areas, such as coal gasification, aerospace, etc. Single crystal sapphire is an excellent candidate for construction of harsh environment sensors due to its superior mechanical and optical properties even at temperature beyond 1600°C. The …
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Novel rare-earth-doped planar waveguide lasers
… solid-state ion-exchange technique based on direct bonding is reported. The fabrication process allows buried waveguide structures to be fabricated by a single-step process, and the resulting guides are shown to have optical losses of < 0.4 dB/cm. Direct UV writing is utilised to fabricate …
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High-average-power planar waveguide lasers
… of planar waveguides are investigated herein: direct-bonded double-clad planar waveguides, ion-exchanged tapered waveguides, and thick films fabricated by pulsed laser deposition, of which a double-clad planar waveguide produced laser output power of up to 58W.<br/><br/>The tapered waveguide …
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Domain engineering techniques and devices in lithium niobate
… thesis presents the results from investigations directed at novel approaches to domain engineering single-crystal congruent lithium niobate at the micron/sub-micron scale for practical device applications. <br/><br/>Experimental etch-rate measurements from a parametric study of etch-rates and …
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High-brightness diode-pumped waveguide lasers
… double-clad planar waveguides, fabricated via direct bonding sapphire and YAG, are the primary structures investigated herein. These high numerical aperture waveguides are ideally suited to high-power diode-pumping due to a combination of features related to their slab-like configuration. …
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Optical Sensors for High-Temperature Pressure Measurement and Real-Time Particle Detection
… by combining reactive ion etching (RIE) with direct wafer bonding. Long-term testing proves that the adhesive-free wafer bond is sufficient to create a sealed Fabry-Perot cavity as a pressure transducer. Pressure measurement over a range of 6 to 200 psi has been demonstrated at room …
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Thermoelectric device characterization and solar thermoelectric system modeling
… 230°C. The experimental technique is capable of directly measuring an energy balance over a single leg, with a large temperature of 2-160°C. The technique measures all three TE properties of a single leg, in the same direction, with significantly less uncertainty than other methods. The …
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Magnetoelectric Composites for On-Chip Near-Resonance Applications
… only exhibit high coupling coefficient due to direct bonding, but also illustrate a self-biased effect due to the built-in stress during co-sintering process. These results present significant advancement toward the development of multifunctional ME devices since it eliminates the need for DC …
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Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules
… blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB …