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Showing 1 to 2 of 2 for “"direct bonded aluminum (DBA)"”.
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Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
… temperature cycling range on the reliability of direct bonded aluminum (DBA) substrate. DBA substrates with different metallization were thermally cycled between -55 oC and 250 oC. Unlike with the DBC substrate, no delamination of aluminum from the aluminum nitride ceramic base-plate was observed …
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Reliability Evaluation of Large-Area Sintered Direct Bonded Aluminum Substrates for Medium-Voltage Power Modules
… efficacy of their sintered silver bonds. Stacked direct-bonded aluminum (DBA) substrates have been found to withstand up to 1000 thermal cycles of –40 °C to 200 °C when attached with low pressure-assisted silver sintering. The thermal performance of 10 kV SiC power module utilizing multi-layer DBA …