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Showing 1 to 14 of 14 for “"copper substrate"”.
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Nanoarchitectured Energy Storage Devices
… method to develop high aspect ratio copper oxide nanowhiskers on copper substrate is presented, which boosts the surface area by 1000 times compared to non-nanostructured copper substrate. Electrochemically deposited MnO2 on the nanostructured substrate provided a specific capacitance …
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Improvement of Homogeneity and Adhesion of Diamond-Like Carbon Films on Copper Substrates
… to deposit diamond-like carbon (DLC) films on copper substrates via anodic oxidation at low temperature. These films are characterized using Raman spectroscopy, Fourier transform infrared spectroscopy and scanning electron microscopy. Homogeneity of these films is studied using Raman …
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Chemical Vapor Etching of Copper Using Oxygen and Various Beta-Diketones
… the reactions of oxygen and beta-diketones on copper metal. The etch rate was studied as a function of time, temperature, grain orientation, oxygen partial pressure, beta-diketone, and beta-diketone partial pressure. Studies were performed at total pressures ranging from 10 to 200 Torr and …
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Electrostatic transfer of graphene grown on copper foil and nanosoldering of carbon nanotube junctions
… involve transferring graphene grown on copper foil using electrostatic force and improving the junction resistance of carbon nanotube (CNT) networks by nanosoldering. Typically, transferring graphene grown on metal substrates involves wet etching steps in order to separate graphene from …
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A General Interfacial Capacitance Model for Nanomaterial Supercapacitors: Insights from Computational Quantum Mechanics
… capacitance can be influenced by the presence of substrates, dopants, and/or electrolyte species. Conventional quantum-capacitance-based series models of graphene capacitors assume no electronic interaction between graphene and its interfacial neighbours, which leads to an overestimation of …
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Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
… in the MPIPPS module. The top DBC (direct bonded copper) substrate in the MPIPPS module helps direct the excessive heat generated from IGBT (Insulated Gate Bipolar Transistor) chips to diode chips (which dissipates less heat). The maximum junction temperature is reduced to 108 oC in the MPIPPS …
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Integrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs)
… devices are placed on a direct bonded copper substrate in a multi-chip module format. The overall goal of this research effort was to optimize the thermal performance of this Gen-II.A IPEM. To achieve this goal, a detailed three-dimensional active IPEM was modeled using the …
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An Electrochemical Investigation into the Corrosion Protection Properties of Coatings for the Active Metal Copper
… (MWCNT), and viologen films adsorbed at copper. The corrosion protective properties of these films were studied and compared to the uncoated copper substrate. They were assessed and studied using a combination of cyclic voltammetry, polarisation curves, Tafel analysis, open-circuit …
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Multi-Photon Spectroscopic Studies of Molecule/Metal Interfaces and Graphene
… organic semiconductor devices. Although the same copper substrate was used for all the experiments, the nature of interfaces was strongly affected by the interaction between molecular adlayers and metal substrate. Our TPPE measurements on two benzenthiol species, thiophenol and p-fluorothiophenol, …
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Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
… °C without applying any pressure. Typically, the substrate, such as direct bond copper (DBC) substrates, has surface metallization such as silver or gold to protect the copper surface from oxidation during the sintering process. This study focused on developing techniques for die-attachment on …
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Rational Fabrication of High-Performance and Scalable Opal Crystals for Thermo-Fluidic Applications
… to predict and control the opal coverage on the substrate as a function of the experimental parameters. Third, we perform experimental validation of our model by fabricating opal samples under different combinations of sphere sizes, colloidal concentrations, slope angles, and temperatures and …
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Packaging of a High Power Density Point of Load Converter
… are traditionally used to spread heat, ceramic substrates are gaining in popularity for their superior thermal qualities which can dissipate heat without the use of a heat sink. 3D integration techniques are needed to realize a solution that incorporates the active and components together. The …
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Two-dimensional Mapping of Interface Thermal Resistance by Transient Thermal Impedance Measurement
… sensor discretely across a large-area bonded substrate and acquiring the interface thermal resistance at each location. As detailed herein, the sensor was fabricated by packaging an IGBT bare die. An analytical thermal model was built to investigate the effects of thermal sensor packaging …
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Development of Solar Sensitive Thin Film for Water Splitting and Water Heating using Solar Concentrator
… black solar absorber material develop over the copper target to absorb concentrated solar radiation and supply heat to the surrounding water. A black copper oxide layer was synthesized over copper substrate by using chemical oxidation treatment. We varied several treatment parameters and …