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Showing 1 to 20 of 23 for “"copper deposition"”.
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Advanced electrochemical characterization of copper deposition
The electrodeposition of copper metal in a concentrated sulfuric acid solution is reported to occur through a four-step mechanism: (I) the dehydration of Cu2+ (H2O)6, (II) the reduction of Cu2+ to cu+, (III) the dehydration cu+ (H2O)6-x, (IV) the reduction of Cu+ to copper metal. The dehydration …
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Investigation of copper deposition on steel in molten copper chloride
… candidate for clean energy generation. The Copper Chloride (Cu-Cl) cycle has been chosen as an effective cycle for production of hydrogen due to its comparatively lower operating temperatures and cost. While most materials subjected to the molten Cu-Cl environment are bound to corrode, …
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Investigating electrochemical reduction processes via in situ enhanced Raman spectroscopy for carbon dioxide conversion and copper deposition
… the loss of signal enhancement as continued Cu deposition converts the substrate from rough to smooth, SHINERS was employed as the signal enhancement method. SHINERS spectra of MPS analogues containing either the thiol or sulfonate functional groups confirmed that the thiol moiety is required …
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Elucidating copper deposition additive structure and its effect on the mechanisms of deposition and the characteristics of the deposit
Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2024-05-01
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Copper Electrodeposition on Iridium, Ruthenium and Its Conductive Oxide Substrate
… properties of sub monolayer and monolayer of copper deposition on the polycrystalline iridium, ruthenium and its conductive oxide. The electrochemical methods cyclic voltammetry (CV) and chronocoulometry were used to study the under potential deposition. The electrochemical methods to oxidize …
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Simulation der Nanostrukturbildung in Alkali-dotierten Fullerenschichten
… Interpretation of experimental data for metal deposition on fullerene substrates can be easily given in the framework of the phase separation concept as well. Metal clusters of the size order 50 to 100 nm emerge in course of electrochemical copper deposition on alkali-doped fullerene layers. …
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Monte Carlo Simulations of the Electrodeposition of Copper From a Sulfate Solution in the Presence of Additives
A simple copper deposition model was developed and compared to the experimental results in three ways, qualitative visual comparisons, scaling analysis of the interface width and current time curves. Parametric studies were performed to make observations about the modeled copper system. A …
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Copper and Copper Alloys: Studies of Additives
Electrodeposition of copper is used extensively for the fabrication of electrical interconnects in semiconductor device manufacturing and in printed circuit board production, as well as other industries. Copper is often plated from an acidic copper sulfate electrolyte with a number of inorganic and …
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Studies Directed to the Development of Long Lived Palladium Membranes for Hydrogen Purification
… the variables involved in electroless deposition of palladium and palladium alloy membranes on a known porous stainless steel substrate, and apply the results to a new and novel porous stainless steel substrate. Different oxide pore and surface treatments were studied. The effect of …
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Studies Directed to the Development of Long Lived Palladium Membranes for Hydrogen Purification
… the variables involved in electroless deposition of palladium and palladium alloy membranes on a known porous stainless steel substrate, and apply the results to a new and novel porous stainless steel substrate. Different oxide pore and surface treatments were studied. The effect of …
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Multiscale modeling of thin film deposition processes
Ionized physical vapor deposition (IPVD) and electrochemical deposition (ECD) are two major thin film deposition processes in the microelectronics industry. The ion fluxes with high kinetic energies in IPVD process involve complex surface interactions that affect overall topology of the microscale …
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Application of voltammetry to copper electrodeposition
… electron microscopy techniques to characterize copper deposition from an acid-sulfate electrolyte. The main process variables investigated were temperature and addition agents (chloride ion, glue, separan or thiourea) at different concentrations, over a range of current densities. Cathodes …
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Mechanism of SPS acceleration in a PEG containing copper plating bath
<p>Deposition of copper in Through Silicon Vias (TSVs) is achieved by addition of organic compounds, which act as suppressors and accelerants to copper electroplating solutions. The focus of this study is on the acceleration effect of bis-(3-sodiumsulfopropyl) disulfide (SPS) which is believed to …
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Spontaneous metal deposition from organic solutions for electronic materials applications
<p>"Electrochemical deposition (ECD) has been used widely in the electronics industry. A novel "galvanic deposition" process was used for spontaneous and selective ECD of metal from organic solutions in contrast to the more conventional aqueous media. The more noble metal ions loaded in the organic …
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Exploring the mechanisms and interfacial processes of metal electrodeposition
Electrodeposition of multivalent metal cations in nonaqueous solvents is ultimately more difficult compared to aqueous systems. This is due to lower conductivity and a smaller library of soluble electrolytes. In many cases, synthesis procedures are required to obtain functional electrolytes. …
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MPSA Effects on Copper Electrodeposition: Understanding Molecular Behavior at the Electrochemical Interface
… at flat non-specific solid surfaces and copper metal electrodes. <em>Ab initio</em> quantum-mechanical calculations are reported and define the interatomic potentials in the simulations. Some of the quantum-mechanical calculations involve small copper clusters interacting with …
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Low dielectric constant fluorocarbon films containing silicon by plasma enhanced chemical vapor deposition
… ultra-large-scale integrated circuits. Copper metallization is another approach besides the use of low-k material, in reducing the RC delay time, because of its well-known characteristics of low resistivity and high electromigration resistance. Fluorocarbon films containing silicon …
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Additive-Assisted Nucleation and Growth of Thin Films: Controlled Experiments and Multiscale Simulations
… seed cluster growth and wild nucleation during copper electrodeposition. Additive compositions that served to suppress the deposition rate (high chloride (10 ppm) and high PEG (3000 ppm)) slowed the deposition rate on the Cu seeds and increased the level of wild nucleation on the Au substrate. …
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Surface chemistry of metal oxide materials: from metalorganic and organic reactions to gas sensing
… control, using a common chemical vapor deposition precursor, copper hexafluoroacetylacetonate vinyl trimethyl silane, Cu(hfac)(VTMS), to grow copper nanoparticles on commercial ZnO powder. This deposition process is investigated by high-vacuum Fourier transform infrared (FT-IR) …
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Thermal and Electrical Considerations for the Design of Highly-Integrated Point-of-Load Converters
… were made by using interlayers and sputtered copper deposition, similar to GE's method. Integration of passives was done using LTCC ferrite to make an inductor of thin profile, rather than embedding cores and windings inside PCB. However, fabrication remained time consuming due to numerous …
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