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Showing 1 to 1 of 1 for “"compressive post"”.
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Development of Bi-Directional Module using Wafer-Bonded Chips
… stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided module to reduce the stress to a level acceptable by silicon dice. For a 14 mm x 21 mm module carrying 6.6 mm x 6.6 mm die, finite-element simulation suggested an optimal …