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Showing 1 to 6 of 6 for “"capacitance extraction"”.

  1. Interconnect capacitance extraction under geometric uncertainties

    … but also for synthesis. For instance, extraction of interconnect capacitance is needed for the prediction of interconnect-induced delay, crosstalk, and other signal distortion related effects that are used to guide IC routing and floor planning. The continuous progress of semiconductor …

    uiuc Repository record for Interconnect capacitance extraction under geometric uncertainties (opens in a new tab)

  2. A hierarchical Markov chain based solver for very-large-scale capacitance extraction

    … FastMarkov and FD-MTM, for computing the capacitance of very-large-scale layout with non-uniform media. Fast- Markov is Boundary Element Method based and FD-MTM is Finite Difference based. In our algorithms, the layout is first partitioned into small blocks and the capacitance matrix of …

    mit Repository record for A hierarchical Markov chain based solver for very-large-scale capacitance extraction (opens in a new tab)

  3. FastCaplet : an efficient 3D capacitance extraction solver using instantiable basis functions for VLSI interconnects

    State-of-the-art capacitance extraction methods for Integrated Circuits (IC) involve scanning 2D cross-sections, and interpolating 2D capacitance values using a table lookup approach. This approach is fast and accurate for a large percentage of IC wires. It is however quite inaccurate for full 3D …

    mit Repository record for FastCaplet : an efficient 3D capacitance extraction solver using instantiable basis functions for VLSI interconnects (opens in a new tab)

  4. Parallel FFTCAP : a parallel precorrected FFT based capacitance extraction program for signal integrity analysis

    Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.

    mit Repository record for Parallel FFTCAP : a parallel precorrected FFT based capacitance extraction program for signal integrity analysis (opens in a new tab)

  5. Modeling multi-layer via structure using PEEC method

    … for via structures is developed for the capacitance extraction between vias and planes. The proposed method can be used to calculate the shared-antipad via structure which is widely used in highspeed differential signal interconnects. In addition, we use the image theory to handle …

    must-thes Repository record for Modeling multi-layer via structure using PEEC method (opens in a new tab)

  6. Shape Approximation of Printed Images in VLSI Design

    … distorted shapes are of interest for electrical extraction of printed circuits. To reduce processing time, it is desirable to approximate the resulting two-dimensional contours with simpler polygons. For the case of capacitance extraction algorithms, pairs of outer and inner approximate polygons, …

    uiuc Repository record for Shape Approximation of Printed Images in VLSI Design (opens in a new tab)