Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 2292 for “"bonding"”.
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Cross-Listing and Corporate Risk Taking: Legal Bonding or Reputation Bonding
<p>Based on the Legal Bonding Hypothesis, proposed by Coffee and Stulz (1999), cross-listing firms can rent a stringent US regulatory regime to improve shareholder protection. However, the reputation bonding hypothesis, put forth by Siegel (2005), questions the efficacy of enforcing US law on …
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Designing Acrylic Block Copolymers with Multiple Hydrogen Bonding or Multiple Ionic Bonding
The dynamic characteristics of hydrogen and ionic bonding contributes to the reversible properties of acrylic polymers, opening new avenues for designing materials with mechanical strength and processability. These non-covalent interactions function as physical crosslinks, which provide enhanced …
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Characterization of anodic bonding
Anodic bonding is a common process used in MicroElectroMechanical Systems (MEMS) device fabrication and packaging. Polycrystalline chemical vapor deposited (CVD) silicon carbide (SiC) is emerging as a new MEMS device and packaging material because of its excellent material properties including high …
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Phosphate bonding in refractories
Thesis (Sc.D.) Massachusetts Institute of Technology. Dept. of Metallurgy, 1950
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Aligned GaAs pillar bonding
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.
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Exploring Multiple Hydrogen Bonding and Ionic Bonding in the Design of Supramolecular Polymers
… processability and recyclability. Dynamic bonding with multiple binding sites, such as multiple hydrogen bonding or multiple ionic bonding, exhibits much stronger binding strength compared to the counterparts containing only a single binding site, thereby allowing for enhanced mechanical …
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Thermoplastic bonding of microfluidic substrates
The assembly of microfluidic components for lab on a chip (LOC) applications that are manufactured from commodity thermoplastics is challenging. A survey of plastic welding techniques validates that contour transmission laser welding is the most viable and commercially demonstrated option for …
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Electrochemical bonding and clay compression
… on the colloid system which in turn affects bonding energies. Temperature influence is considered to be representative of the effect of various parameters on the distribution of net electrochemical potential in the colloid system. The final study entails determining the action of soil …
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Laser Activated Bonding of Wood
… composite without the need of any additive. This bonding method removes the need of applying adhesive, potentially lowers cost, and eliminates off gassing of petroleum resins, creating a wood product with many eco-friendly attributes. This body of work outlines a) initial chemical analysis of the …
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Clinical Acceptability of Digital Indirect Bonding Compared to Direct Bonding by Varying Orthodontic Experience: Pilot Study
… placement between digital indirect and direct bonding techniques and between participants with three levels of varying orthodontic experience (dental students, orthodontic residents, experienced orthodontists) using one intervention model. The percentage of clinically acceptable bracket …
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Studies of Bonding and Intermolecular Interactions
Made available in DSpace on 2014-12-10T23:01:45Z (GMT). No. of bitstreams: 1 7412099.pdf: 7557258 bytes, checksum: 19790f77a3bfceeb29465d428d42ef19 (MD5) Previous issue date: 1973
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Kinetics of transient liquid phase bonding
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1993.
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Mechanics aspects of water thermocompression bonding
Wafer-level, thermocompression bonding is a promising technique for microelectromechanical systems (MEMS) packaging. The process is a form of solid-state joining and requires the simultaneous application of temperature and pressure to wafers patterned with metallic thin films in order to bring the …
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Ultrathin silicon wafer bonding physics and applications
Ultrathin silicon wafer bonding is an emerging process that simplifies device fabrication, reduces manufacturing costs, increases yield, and allows the realization of novel devices. Ultrathin silicon wafers are between 3 and 200 microns thick with all the same properties of the thicker silicon …
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BONDING BETWEEN FOSTER PARENTS AND FOSTER CHILDREN
<p>This study focused on the reason that close to 500,000 children were in the foster care system in 2009 in the United States, and the average length of care was over 26 months. The primary focus was why foster parents are unable to form a bond with the children placed in their home and the …
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Micromachined infrared detector using wafer bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.
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Copper wafer bonding in three-dimensional integration
… integrated circuits keep shrinking. Copper wafer bonding has been considered as a strong candidate for fabrication of three-dimensional integrated circuits (3-D IC). This thesis work involves fundamental studies of copper wafer bonding and bonding performance of bonded interconnects. Copper bonded …
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