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Thermo-mechanical Analysis of a Custom PCB-DBC Hybrid Package for a (650 V, 150 A) e-GaN HEMT

Nicholas, Carl PeterVirginia Tech2023

… culminated in a printed circuit board-direct bonded copper (PCB-DBC) hybrid package to house a 650 V, 150 A GaN HEMT. Called the PCB-Interposer-on-DBC package, it utilizes a DBC for heat extraction while using vertical pin interconnects to minimize electrical parasitics. Previous work did not …

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