Global ETD Search

High-Resolution Nyquist -Rate Analog -to -Digital Converter

Chen, Hsin-ShuUniversity of Illinois at Urbana-Champaign2015

… 2 including digital logic, output buffers, and bond pads, and consumes 720 mW at 5 V.

uiuc Repository record for High-Resolution Nyquist -Rate Analog -to -Digital Converter (opens in a new tab)

Antenna-coupled Infrared And Millimeter-wave Detectors: Fabrication, Measurement And Optimization

Middleton, Charles

… detector through a ground plane to bond pads to mitigate the effect of bias lines on antenna behavior.

ucf

Flip Chip testing with a capacitive coupled probe chip.

Stanaski, Andrew2003

… visible for probing. On chips that use perimeter bond pads the face of the chip is exposed, so signals on the wiring in the top layer metal may be probed while the chip is in operation. This is not possible when the face of the chip is hidden. This work proposes a way to probe test points on the …

ncsu Repository record for Flip Chip testing with a capacitive coupled probe chip. (opens in a new tab)

Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies

Ralston, Parrish ElaineVirginia Tech2013

… for microwave applications compared to wire bond interconnections because of their reduced parasitics, more compact architecture, and flexibility in laying out flip chip bond pads. Reduction in interconnect parasitics enables these interconnects to support broadband signals, therefore …

vt Repository record for Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies (opens in a new tab)

ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING

NG WEI CHIN2000

nus Repository record for ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING (opens in a new tab)