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Showing 1 to 1 of 1 for “"area array I/O"”.
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Flip Chip testing with a capacitive coupled probe chip.
Testing integrated circuits that employ an area array of I/O presents unique challenges because the face of the chip is not visible for probing. On chips that use perimeter bond pads the face of the chip is exposed, so signals on the wiring in the top layer metal may be probed while the chip is in …