Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 13 of 13 for “"anodic bonding"”.
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Characterization of anodic bonding
Anodic bonding is a common process used in MicroElectroMechanical Systems (MEMS) device fabrication and packaging. Polycrystalline chemical vapor deposited (CVD) silicon carbide (SiC) is emerging as a new MEMS device and packaging material because of its excellent material properties including high …
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Solution for a modular die-level anodic bonder
Anodic bonding is a common way to package silicon with Pyrex. The anodic bonding process requires high temperature, voltage, and moderate pressure to occur. Often, there are also expectations of alignment of features for things such as power or material delivery. The following thesis proposes a …
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Fabrication and characterization of nanofluidic channels for studying molecular dynamics in confined environments
… of PDMS micromolding and the substrate bonding techniques including both anodic (Si-glass) and thermal fusion (glass-glass) bonding, in fabricating sub-100-nm thick nanofluidic channels, which will be used for a controlled experimental study of molecular and fluidic transport in confined …
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Effect of radiation on silicon and borosilicate glass
… gauges, however. It is hypothesized that the anodic bonding process (by which a silicon wafer was bonded to the glass before etching to create the MEMS strain gauges) was responsible for either 1) changing the bulk radiation response of the glass or 2) creating a layer near the bond interface …
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A circular electrostatic zipping actuator for the application of a MEMS tunable capacitor
… mainly by the deep reactive ion etching and anodic bonding microfabrication techniques.
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A silicon micromachined subminiature condenser microphone : analysis, design, fabrication and testing
… contain the airgap and side volume cavity. An Anodic bonding technique is used to bond the silicon membrane with the backplate. The silicon diaphragm is used as the moving electrode and the Pyrex glass backplate is made into a back electrode by a thin deposition of metal on it
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Design and Fabrication of Nanofluidic Systems with Integrated Sensing Electrodes for Rapid Biomolecule Characterization
… and used to cap the nanochannel chip through anodic bonding. The completed nanofluidic system was tested successfully for flow patency by pumping Fluorescein Isothiocyanate (FITC) through the nanochannel. The average flow rate in the nanochannel was estimated by monitoring the displacement of …
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Hydraulic amplification for actuation in microelectromechanical systems
… using Silicon On Insulator (SOI) technology. Bonding techniques included silicon-silicon fusion bonding of fragile wafers and silicon-glass anodic bonding and alignment on the wafer and die level to produce multi-layered structures. Liquid filling of micromachined dead volumes through …
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Polyelectrolyte multilayers (PEM) in micro / nanofluidics for novel BioMEMS platforms
… deposition of polyelectrolyte. Silicon-to-glass bonding was achieved by electrostatic interaction at lower temperature (180 'C) than conventional anodic bonding temperatures (300-400 C), and even at room temperature (25 C). The second part of this thesis focuses on patterning bacteria on …
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3-D Bio-inspired Microenvironments for In Vitro Cell Migration
… from silicon structures to glass following anodic bonding and high temperature glass re-flow processes. Silicon is etched back thoroughly via wet etching and the glass is used as master device to create 3-D PDMS structures for use in dielectrophoresis cell sorting applications. Furthermore, …
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Ultra-thin III-V photovoltaic technology for space applications
… fabrication challenges. Conventional adhesive bonding of multi-junction III-V solar cells to cover glass and mechanical support does not effectively apply to the ultra-thin schemes due to the intrinsic mismatch of coefficients of thermal expansion, and susceptibility to fabrication and …
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Development of a micromachined electrostatically suspended gyroscope
… using a triple-stack glass-silicon-glass anodic bonding in combination with a high-aspect-ratio DRIE process. Fabrication results and processing issues were discussed. However, it was found that the rotor of the fabricated gyroscopes was stuck to the substrate. Therefore, a fabricated …
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Design and fabrication of a single-layer guided mode resonance grating transmission filter
… a GaP wafer with a high dose of helium and bonding to borosilicate glass. It is seen that the surface of the implanted GaP adheres strongly to the glass and separates from the substrate, leaving a thin film with a consistent thickness and an rms roughness of around 10 nm. Gratings are …