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Showing 1 to 1 of 1 for “"adhesive blister test"”.
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Finite Element Analysis of Probe Induced Delamination of a Thin Film at an Edge Interface
… is of interest because it simulates a probe test that has proven to be useful in characterizing the adhesion of thin, microelectronic coatings bonded to silicon wafers. Preliminary experimental results indicate that out-of-plane rather than in-plane loading dominates failure in the system. …