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Showing 1 to 14 of 14 for “"adhesion layer"”.

  1. Properties and Applications of Amorphous Gallium Arsenide Annealed to a Polycrystalline Form

    … relatively low temperature makes it useful as an adhesion layer for wafer bonding. Using amorphous GaAs as an adhesion layer, GaAs substrates have been bonded to GaAs, InP, and glass at 400°C. MBE regrowths on bonded samples have shown moderate success.

    uiuc Repository record for Properties and Applications of Amorphous Gallium Arsenide Annealed to a Polycrystalline Form (opens in a new tab)

  2. Towards a universal ultra-thin fluorinated diamond-like carbon coating for nanoimprint lithography imprinters

    … pattern depends on the elimination of the adhesion between the imprinted polymer and the imprinter upon withdrawal of the imprinter. The plasma deposition of a layer of fluorinated diamond-like carbon (F-DLC) has proven to be a successful anti-adhesion layer but in the past has required an …

    rowan Repository record for Towards a universal ultra-thin fluorinated diamond-like carbon coating for nanoimprint lithography imprinters (opens in a new tab)

  3. Highly Transparent, Self-cleaning, and Antireflective Nanoparticle Coatings

    … by utilizing a polyvinylpyrrolidone (PVP) adhesion layer during the deposition process. Using this method, the solar weighted transmittance of glass was improved to 97.4%, with peak transmittance of 99.5%, using a double sided coating. </p> <p>The short-circuit current and conversion …

    arkansas Repository record for Highly Transparent, Self-cleaning, and Antireflective Nanoparticle Coatings (opens in a new tab)

  4. Precision Self -Alignment Techniques for Optoelectronic Integration

    … procedures are presented, such as the use of an adhesion layer to facilitate solder reflow and a V-groove planarization process to facilitate planar processing. The combination of these techniques for the integration of optoelectronic components with the provision of mutual alignment between them …

    uiuc Repository record for Precision Self -Alignment Techniques for Optoelectronic Integration (opens in a new tab)

  5. Characterization of Diamond-Semiconductor Interfaces

    … as well as substrate material (Si versus SiNx adhesion layers used to produce GaN-on-diamond structures). Finally, a detailed analysis of a GaN-diamond interface formed without the use of an adhesion layer created by a combination of selected area diamond seeding and epitaxial lateral …

    texas-state Repository record for Characterization of Diamond-Semiconductor Interfaces (opens in a new tab)

  6. Nonlinear optical emission and near-field enhancement effects in arrays of gold bowtie nano-antennas

    … beam-scanning pattern, and the use of a chromium adhesion layer. Finally, the increased optical forces in a trapping system resulting from the field enhancement of arrays of BNAs is demonstrated. In addition, based on the exclusive behaviors of these types of systems, a new method of …

    uiuc Repository record for Nonlinear optical emission and near-field enhancement effects in arrays of gold bowtie nano-antennas (opens in a new tab)

  7. Magnetic nanostructures patterned by block copolymer lithography

    … wafers by UHV sputtering. Ti was used as an adhesion layer and texture promoter so that the easy magnetic axis of Co is aligned perpendicular to the sample plane. Magnetic reversal of Ti/CoCrPt films and Ti/CoCrPt/Ti/CoCrPt pseudo spin valve films is a domain nucleation and growth process …

    mit Repository record for Magnetic nanostructures patterned by block copolymer lithography (opens in a new tab)

  8. Interfacial spallation/delamination properties of self-assembled monolayers

    Self-assembled monolayers (SAMs) are short (nanometer-size) organic chains terminated by functional groups that can be selected to tailor the electrical, thermal and/or mechanical properties of interfaces. In this thesis, we investigate how the presence of SAMs affects the failure properties of …

    uiuc Repository record for Interfacial spallation/delamination properties of self-assembled monolayers (opens in a new tab)

  9. An investigation of thin amorphous carbon-based sputtered coatings for MEMS and micro-engineering applications

    … at all thicknesses tested. The use of a Cr adhesion layer produced beneficial results at 150 nm thickness, but was ineffective at 50 nm. Argon flow to the coating chamber produced a complex effect. All effects reduced significantly with reducing film thickness. Classic fretting wear was …

    aston Repository record for An investigation of thin amorphous carbon-based sputtered coatings for MEMS and micro-engineering applications (opens in a new tab)

  10. A Schottky-to-Ohmic Transition in Epitaxial Ferroelectric Hafnia Devices

    … using an Au top electrode with an ultra-thin Ti adhesion layer, a resistance switching mode with large on-off ratio was observed. The pristine device was stabilised in an intermediate resistance state and did not need an electro-forming process. The mode reversibly switched between a purely …

    cambridge Repository record for A Schottky-to-Ohmic Transition in Epitaxial Ferroelectric Hafnia Devices (opens in a new tab)

  11. Development of label-free colorimetric plasmonic sensor for biomedical applications

    … 3 starts with the discussion on the influence of adhesion layer on the optical properties of the nanoLCA device followed by layer by layer deposition of polyelectrolyte layers to identify the decay length of the device. Furthermore, this chapter also describes the deposition of different polymers …

    uiuc Repository record for Development of label-free colorimetric plasmonic sensor for biomedical applications (opens in a new tab)

  12. Electromechanical response of textured ferroelectric PZT thin film stacks

    … other films forming a stack. These additional layers serve as seeding (TiO2), buffer (SiO2), and conducting (Pt) layers with substantial thickness and stiffness compared to the main PZT layer. As a result, quantitative understanding of the mechanical behavior of each layer is required in order …

    uiuc Repository record for Electromechanical response of textured ferroelectric PZT thin film stacks (opens in a new tab)

  13. Process Evaluation and Characterization of Tungsten Nitride as a Diffusion Barrier for Copper Interconnect Technology

    … intensity ratio vs. time plots demonstrates layer by layer Cu growth for the clean tungsten (W) surface and three-dimensional nucleation for the nitride overlayer. Auger intensity ratio vs. temperature measurements for the Cu/W system indicates a stable interface up to 1000 K. For the Cu …

    unt Repository record for Process Evaluation and Characterization of Tungsten Nitride as a Diffusion Barrier for Copper Interconnect Technology (opens in a new tab)

  14. Plasmonic nanoantennas for multipurpose particle manipulation and enhanced optical magnetism

    … spacing including bowtie array spacing, adhesion layer materials, nanostructure orientation, composition of the fluid trapping media, optical polarization, input optical power, and trapped-particle diameter. Using theoretical modeling, it is shown that plasmon-induced convection drives …

    uiuc Repository record for Plasmonic nanoantennas for multipurpose particle manipulation and enhanced optical magnetism (opens in a new tab)