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Showing 1 to 1 of 1 for “"Wirebond Reliability Assessment"”.
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Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules
… thermal performance, parasitic extraction and wirebond/encapsulation reliability of power electronic modules. Thermal performance is critical to the power electronic modules. As such, thermal analysis is an important part of the power electronic module design process. Several cases are studied …