Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 18 of 18 for “"Wire bonding"”.
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Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
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Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
… industry is pushing the limits of current wire bonding packaging technology. Emerging three-dimensional power packaging techniques have shown their potential to replace wire bonding technology down the road. However, these innovative technologies have not yet been fully understood in terms …
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Optoelectronic integration using the magnetically assisted statistical assembly technique : initial magnetic characterization and process development
… heavily relies on hybrid techniques such as wire bonding and flip-chip bonding. These methods are limited in the scale and flexibility in integration. Research focused on optoelectronic integration is performed using numerous techniques such as direct epitaxy, full-scale wafer bonding, and …
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Optimizing Multi-Well Micro-Electrode Array (MW-MEA) Design to Study the Electrophysiology of Neurons
… used with living cells. In parallel, a gold wire bonding process was attempted to create 3D microelectrodes on the fMEA. 3D-fMEA fabrication proved to be challenging due to several difficulties in the wire bonding process, used for converting the planar fMEA to 3D-fMEA. Thus, to further the …
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Unlocking SiC MOSFET Switching Performance Through Packaging and Instrumentation
… these emerging high-speed devices. Traditional wire-bonding packaging technologies that were originally developed in the 1950's are still being used today, with the majority of power modules on the market using bond-wires for transistor connections. Wire-bonding introduces significant stray …
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Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
… and developed as a substitution for traditional wire-bonding vertical structure. The planar structure was applied to a high temperature (>250oC) SiC power device. Based on the current-voltage (I-V) measurements, the packaging structures were improved, materials were selected, and processes were …
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Design and analysis of ultra-wide band and millimeter-wave antennas
… thesis for developing high-speed short-range wireless communications. Firstly, a probe-fed crossed circle-disk monopole UWB antenna with stable omnidirectional radiation pattern was studied. The antenna was then cut by half to form a crossed semi-circle monopole antenna with a top-loaded patch …
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Design and fabrication of an underwater digital signal processor multichip module on low temperature cofired ceramic
… printed on the top surface of the module for wire bonding and on the bottom surface of the module for pin attachment. The main objectives of this thesis work were to convert silicon UDSP MCM to ceramic using LTCC, learn a new tool in CAD design that incorporates an autorouter, apply the tool …
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Electro-optic polymer-based monolithic waveguide devices with multi-functions of amplification switching and modulation
… plating, wafer dicing, waveguide polishing, and wire bonding, have been investigated in depth. All these techniques can be applied to make not only electro-optic polymeric devices, but thermal-optical polymeric devices as well. Straight channel array, Y-coupler array, and X-junction have been …
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Technology for Planar Power Semiconductor Devices Package with Improved Voltage Rating
… semiconductor packaging technologies includes wire-bonding interconnect, press pack, flip-chip technology, metal posts interconnected parallel plates structure (MIPPS), dimple array interconnection (DAI), power overlay (POL) technology, and embedded power (EP) technology. None of them meets the …
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An Electronic Control Architecture for a Photonic Integrated Circuit
… integrated on Printed Circuit Boards through wire-bonding technique, realizing modules easily integrated and re-configured with the custom made interposer board and the multiple voltage drivers that are at the core of the electronic architecture. Then, both the thermistors and the photodiodes …
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Integrated Thermal Management Strategies for Embedded Power Electronic Modules
… and compact volume, replacing the traditional wire bonding technology. They have the potential to offer reduced time and effort associated with developing and manufacturing power processors. However, placing multiple heat generating chips in a small volume also makes thermal management more …
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Micro- and nano-soft lithography for the fabrication of photonic devices
… used to form a contact with the n-GaN to enable wire-bonding and characterisation of the LED. This mask-free process is attractive as fabrication of conventional masks for photolithography is both costly and lengthy. Possessing the ability for define LED patterns "free form" on photoresist and …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
… SBD was fabricated by sintering die-attach and wire-bonding. The tested results demonstrate that the sintering nanoscale silver paste can be applied as a viable die-attach solution for high-temperature application.
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Interfacial physics in meniscus-confined electrodeposition and its applications for fabricating electronic structures
A novel three-dimensional micro-/nano-fabrication method, the meniscus-confined electrodeposition, was developed and studied. It exploits the thermodynamic stability of a microscale or nanoscale liquid meniscus to direct-write pure metallic three-dimensional structures of designed shapes and sizes …
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Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints
… pressure-sintering of silver. The process for wire bonding, lead-frame attachment, and thermocouple attachment are also recorded. Modules with the above three kinds of joints were first characterized by electrical methods. All of them could block 1200 V DC voltage after packaging, which is the …
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Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules
… (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules …
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Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging
… paste. XPS analysis revealed a higher oxygen bonding percentage for the 10% nanosilica ceramic sample than other samples. XRD peak broadening is largest for the 10% nano-silica ceramic which indicated smaller crystallite sizes. The smaller crystallite size for the 10% nanosilica sample …