Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 59 for “"Wafer bonding"”.
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Ultrathin silicon wafer bonding physics and applications
Ultrathin silicon wafer bonding is an emerging process that simplifies device fabrication, reduces manufacturing costs, increases yield, and allows the realization of novel devices. Ultrathin silicon wafers are between 3 and 200 microns thick with all the same properties of the thicker silicon …
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Micromachined infrared detector using wafer bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.
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Copper wafer bonding in three-dimensional integration
… in integrated circuits keep shrinking. Copper wafer bonding has been considered as a strong candidate for fabrication of three-dimensional integrated circuits (3-D IC). This thesis work involves fundamental studies of copper wafer bonding and bonding performance of bonded interconnects. Copper …
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Wafer bonding : mechanics-based models and experiments
Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of …
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Silicon pressure sensor using wafer bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
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Three dimensional integration technology using copper wafer bonding
… integration flow has been developed on both the wafer-and-die-level, and the enabling technologies were the following: Low temperature Cu-Cu thermocompression bonding, an aluminum-Cu based temporary laminate structure used stabilizing the handle wafer - SOI wafer bond, and tooling optimization of …
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Integrated silicon pressure sensors using wafer bonding technology
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997.
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A liquid-shear-stress sensor using wafer-bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.
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Heterostructurally Integrated Iii-V Semiconductors Fabricated by Wafer Bonding Technology
… grown amorphous alpha-(Ga, As) materials and wafer-bonding technology to fabricate GaSb semiconductor on GaAs substrates to potentially create GaSb-on-insulator structure has been demonstrated.
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Multi-layer three-dimensional silicon electronics enabled by wafer bonding
… silicon multi-layer stack. Low temperature wafer bonding processes, both copper thermo-compression bonding and silicon dioxide fusion bonding, are studied extensively as key enabling technology. Cu thermo-compression bonding is studied for its feasibility as a permanent bond between active …
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Near junction thermal management of GaN HEMTs via wafer bonding
… operation. This thesis proposes and examines wafer bonded GaN-on-SiC HEMTs as a thermally efficient alternative to growth structures. This work first compares the thermal properties of this novel structure to the state-of-the-art. It then develops suitable wafer bonding techniques to fabricate …
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Wafer Bonding With Low-Temperature Grown Compound Semiconductor Materials for Optoelectronic Device Application
Finally, I developed two methods to transfer a GaAs-based device layer on a transparent GaP substrate (for emission wavelength longer than 560 nm), which involve multiple processing techniques. One approach also includes the regrowth step, which further indicates the bonded sample can further be …
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Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration
The successful bonding of bare thinned Si SOI wafers to bare GaAs wafers in previous research has proven to be an important first step in achieving integration of Si electronics with GaAs optoelectronic devices. The thinning of the SOI wafer has been shown to be a successful solution to the problem …
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A thin-film silicon microaccelerometer fabricated using electrochemical etch-stop and wafer bonding technology
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1994.
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Design and Fabrication of Long -Wavelength Vertical -Cavity Surface -Emitting Lasers Using Wafer Bonding Technologies
… (DBR) and the fabrication complexity of direct wafer bonding. In this work, a novel VCSEL fabrication method facilitated with new wafer bonding techniques has been developed to overcome these limitations. This process scheme provides more options on the DBR and substrate materials for …
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Wafer bonding for monolithic integration of Si CMOS VLSI electronics with III-V optoelectronic devices
GaAs-on-silicon epitaxy techniques as well as wafer bonding GaAs to Si, have been developed to overcome lattice mismatch in order to integrate optoelectronic and Si devices. However, the thermal expansion differences between these materials continues to be a limitation in using either of these …
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A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.
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Aluminum Gallium Arsenide-Indium Gallium Arsenide Crystal Growth, Buried Tunnel Contact Lasers, Wafer Bonding, and Alluminum Gallium Arsenide Oxide-Based VCSELs
… epitaxial material grown on a single substrate, wafer bonding has been developed over the last decade and is now introduced to the Solid State Devices Laboratory. Resistors are formed by simply bonding two n-type substrates together in order to optimize wafer preparation and bonding parameters. …
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An evaluation of critical issues for microhydraulic transducers : silicon wafer bonding, strength of silicon on insulator membranes and gold-tin solder bonding
… to the development of MHT devices, are silicon wafer bonding, strength of silicon-on- insulator (SOI) membranes, and gold-tin bonding. Each of these topics was addressed independently. The mechanical integrity of silicon fusion bonds as a function of processing parameters was examined using a …
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Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Wafer bonding is a key process and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced interconnect delay and correspondingly increased circuit speed and decreased power dissipation, along with an improved form factor and portability. One of the most …
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