Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 5 of 5 for “"Underfill Materials"”.
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Underfill material selection for flip chip technology
Six underfill materials were examined for the selection of an appropriate underfill material for Digital Equipment Corporation's flip chip development project. Several tests were performed to determine the material properties, process properties, and the reliability of each underfill material. A …
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Study on the Nanocomposite Underfill for Flip-Chip Application
Underfill material is a special colloidal dispersion system with silicon dioxide particles in the organic liquid. It is used to improve the reliability of integrated circuits (IC) packaging in the microelectronics. In order to successfully synthesize the nanocomposite underfill meeting the …
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Design of experiment analysis of an electronics package lid using finite element analysis
… The present study focuses on the variety of materials and designs of lids relevant to recent technologies in electronics packaging. The finite element analysis (FEA) formulation in this study accurately predicts deformation and warpage in the elastic region with optimal computational time …
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Low Volume Dispensing with High Speed Dispensers
… a detailed approach of dispensing low volumes of materials in terms of weight per pulse having target weight being less than or equivalent to 0.050 mg. This feature is defined through characterizing the dispensing pump to get the desired weight per pulse with good weight repeatability, dot …