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Showing 1 to 1 of 1 for “"Under Bump Metallurgy (UBM)"”.
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UBM Formation on Single Die/Dice for Flip Chip Applications
This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallurgy) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between …