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Showing 1 to 2 of 2 for “"Under Bump Metallization"”.
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Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization
… reliability analysis of indium interconnects and Under Bump Metallization (UBM) in flip chip devices. Flip chip assemblies with the use of bump interconnections are frequently used, especially in high density, three-dimensional electronic devices. Currently there are many methods for interconnect …
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Numerical Study For Acoustic Micro-Imaging Of Three Dimensional Microelectronic Packages
… the modelling of a flip chip with a 140µm solder bump assembly, which is implemented with a 230MHz virtual raster scanning transducer with a spot size of 17µm. The Virtual Transducer was designed to reduce the total numerical elements from hundreds of millions to hundreds of thousands. Thirdly, …