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Showing 1 to 1 of 1 for “"Ultrathin Silicon Wafer Bonding"”.
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Ultrathin silicon wafer bonding physics and applications
Ultrathin silicon wafer bonding is an emerging process that simplifies device fabrication, reduces manufacturing costs, increases yield, and allows the realization of novel devices. Ultrathin silicon wafers are between 3 and 200 microns thick with all the same properties of the thicker silicon …