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Showing 1 to 7 of 7 for “"Tin-Silver"”.
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Nucleation and growth kinetics of tin and tin -silver alloy during initial stages of electrodeposition
… thickness control for chip interconnects. Pure tin, tin-silver and tin-silver-based solders have been identified as leading candidates for lead-free solders due to the desirable melting point, good creep resistance and thermo-mechanical behavior.</p><p>The initial stage of electrodeposition, or …
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Nichtionische polyethoxylierte Tenside in methansulfonsauren Zinn- und Zinn-Silber-Elektrolyten
… of nonionic polyethoxylated surfactant on Tin- and Tin-Silver depositions. Cyclovoltammetry, electrochemical depositions in Hull cell, with quartz crystal microbalance, impedance spectroscopy, X-ray diffraction, REM and others were used as methods of characterization.
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Precision Self -Alignment Techniques for Optoelectronic Integration
… The self-alignment potential of eutectic tin-silver solder bump arrays to produce sub-quarter-micron alignment precision is demonstrated. The potential for V-groove dimensional control to enable sub-half-micron optical fiber positioning is also demonstrated. Optimal materials and …
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Enhancing the heat transfer performance of compact heat exchangers by minimizing the contact resistance between fins and tubes
… studies and finite element analysis investigating the effects of expansion bullets and coatings on the thermal contact conductance. An apparatus has been designed and fabricated for the experimental part of the work. A finite element model established the fintube configuration to be used in …
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Creep behaviour of the ternary lead-free solder alloy : Sn-3.8wt.%Ag-0.7wt.%Cu
… to that observed for the self-diffusion of tin. In joint form the stress exponent is greater than 10 at high stresses but a change in mechanism is indicated at lower stress where the creep exponent falls to 3. The activation energy for creep in Sn-Ag-Cu when used in joint form is …
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Flex Cracking and Temperature-Humidity-Bias Effects on Reliability of Multilayer Ceramic Capacitors
… flexible termination system which incorporates a silver-loaded epoxy in end-terminations was developed by some MLCC manufacturers. With the transition to lead-free materials in the electronics industry there is a concern that MLCCs assembled on PCBs with lead-free solder have different …
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Modelling of the reliability of flip chip lead-free solder joints at high-temperature excursions
… operations of electronic control devices, Tin-Silver-Copper (SnAgCu) alloy solder joints used to assemble the component of the devices are functioning at homologous temperature above 0.8. In such ambient temperatures, solder alloys have limited mechanical strength and will be sensitive to …