Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 5 of 5 for “"Through Silicon Vias (TSV)"”.
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Multilayer Micromachined RF MEMS Filters at Ka and L/S Band For On-Board Satellite Communication Systems
… (Ag) as an intermediate layer and fabrication of Through Silicon Vias (TSV).
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PI AND EMI ANALYSIS OF 3D IC SYSTEM WITH TSVS AND CO-PACKAGED OPTICS
… hysteresis behavior of a through-silicon-vias (TSV) structure in 3D IC and analyzing its effect on the power integrity of a system with 3D IC.</p> <p>This second paper investigates the scaled tendency of the emissions in a router system loaded with hundreds of optical …
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Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages
… per volume and improved electrical performance through short vertical interconnect paths. Mechanical reliability of 3D IC packages is critical due to the widespread use of electronic devices. Misalignment induced shear deformation of the through-silicon vias (TSV) and solder micro-bumps are …
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Using far-field measurements for determining mixed-mode interactions at interfaces
… the end loaded split (ELS) configuration for a silicon-epoxy interface, where the epoxy thickness was used to control the phase angle of the fracture mode-mix. Infra-red crack opening interferometry (IR-COI) was used to measure the normal crack opening displacements. For the resistance curves, …
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Refresh reduction in dynamic memories
… stacks. We propose the Xylem Thermal Through Silicon Via (TTSV) placement schemes, to reduce the temperature of the DRAM dies and the processor die in the stack. The TTSV placement should respect the DRAM array structure and handle unknown multicore hotspots. The resulting temperature …