Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 3 of 3 for “"Three-dimensional packaging"”.
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Design, Analysis and Experimental Verification of a Mechanically Compliant Interface for Fabricating Reliable, Double-Side Cooled, High Temperature, Sintered Silver Interconnected Power Modules
… developed a double-side power electronics packaging scheme for high temperature applications exemplified by 1200 V, 150 A silicon devices. The power modules, based on both quarter and half-bridge topologies, were assembled using sintered silver device attachment rather than conventional …
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High-frequency characterization of embedded components in printed circuit boards
The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the …
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Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules
… is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel …