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Showing 1 to 1 of 1 for “"Three-dimensional electronics, Compressive buckling, Transfer printing"”.
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Three-dimensional (3D) electronics by compressive buckling process
A compressive force from releasing a pre-stretched elastomer substrate such as PDMS, Ecoflex, and Dragon Skin induces a 2D precursor to realize a sophisticated 3D electronic structure of a resistor, capacitor and transistor. Conventional microfabrication methods create 3D electronic components, and …