Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 19 of 19 for “"Three-Dimensional Integrated Circuits"”.
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Electrothermal Analysis of Three-Dimensional Integrated Circuits.
North Carolina State University Theses Electrical Engineering.
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Environmentally benign manufacturing of three dimensional integrated circuits
… 2D IC approach. Both options are compared on all three axes - performance, cost and environmental impact.
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Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.
North Carolina State University Theses Electrical Engineering.
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System-level performance evaluation of three-dimensional integrated circuits
… design continue to shrink, system performance of integrated circuits (ICs) will be increasingly dominated by interconnect delay [1]. For the technology generations approaching 50 nm and beyond, innovative system architectures and interconnect technologies will be required to meet the projected …
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Design automation and analysis of three-dimensional integrated circuits
This dissertation concerns the design of circuits and systems for an emerging technology known as three-dimensional integration. By stacking individual components, dice, or whole wafers using a high-density electromechanical interconnect, three-dimensional integration can achieve scalability and …
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Thermal designs, models and optimization for three-dimensional integrated circuits
Three-dimensional integrated circuits (3D ICs), a novel packaging technology, are heavily studied to enable improved performance with denser packaging and reduced interconnects. Despite numerous advantages, thermal management is the biggest bottleneck to expanding the applications of this device …
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Characterization of bonded copper interconnects for three-dimensional integrated circuits
… industry is demanding ultra large-scale integrated (ULSI) circuits with increasing performance at minimum cost and power dissipation. As the critical dimensions in ULSI design continue to shrink, system performance of integrated circuits will be increasingly dominated by interconnect …
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Laser Crystallization of Silicon Thin Films for Three-Dimensional Integrated Circuits
The three-dimensional integration of microelectronics is a standard that has been actively pursued by numerous researchers in a variety of technical ways over the years. The primary aim of three-dimensional integration is to alleviate the well-known issues associated with device shrinking in …
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System and Gate-level Dynamic Electrothermal Simulation of Three Dimensional Integrated Circuits.
North Carolina State University Theses Electrical and Computer Engineering.
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Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits
Three-dimensional integrated circuit (3D IC) technology enables heterogeneous integration of devices fabricated from different technologies, and reduces global RC delay by increasing the device density per unit chip area. Wafer-level Cu-Cu thermocompression bonding provides an attractive route to …
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Design and implementation of three-dimensional logic structures
… is developed that assists in the design of novel three-dimensional integrated circuits. The software tools allow for the specification of a multilayer transistor circuit by means that are readily accessible to those familiar with two-dimensional CMOS VLSI design. This software system provides …
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Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
… and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced interconnect delay and correspondingly increased circuit speed and decreased power dissipation, along with an improved form factor and portability. One of the most recent novel and promising …
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Stability analysis for SRAM cells with TSV induced stress in 3D ICs
Three-dimensional integrated circuits (3D-IC) have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs while also helping to reduce wire delay and increase memory throughput. While this technology offers many potential advantages, it also produces …
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Multi-layer three-dimensional silicon electronics enabled by wafer bonding
Three-dimensional integrated circuits (3-D ICs), in the form of a vertical stack of several interconnected device layers, have many performance, form factor, and integration advantages. The main objective of this work is to develop reliable process technology to enable the fabrication of a …
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Wafer bonding : mechanics-based models and experiments
… microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of knowledge of the basic mechanics of the process has made developing robust processes and preventing process failures …
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Copper wafer bonding in three-dimensional integration
Three-dimensional (3D) integration, in which multiple layers of devices are stacked with high density of interconnects between the layers, offers solutions for problems when the critical dimensions in integrated circuits keep shrinking. Copper wafer bonding has been considered as a strong candidate …
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Design and Study of an Electron Beam System for Silicon Recrystallization
The fabrication of Three-Dimensional Integrated Circuits (3D-ICs) is a key advancement in semiconductor technology. Technologies like Silicon-On-Insulator (SOI) can be used for the individual layers of a 3D-IC. 3D-ICs offer the potential to create more compact and powerful devices, which can be …
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Placement for fast and reliable through-silicon-via (TSV) based 3D-IC layouts
… temperature, and quality trade-offs, found in three-dimensional integrated circuits (3D ICs) that use through-silicon vias (TSVs) at placement stage. Four main works that support this goal are included. In the first work, wirelength of TSV-based 3D ICs is the main focus. In the second work, …
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Electro-Thermal Codesign in Liquid Cooled 3D ICs: Pushing the Power-Performance Limits
… heat sink has been proved to be insufficient for three dimensional integrated circuits (3D-ICs). Hence better cooling solutions are necessary. Micro-fluidic cooling, which integrates micro-channel heat sinks into silicon substrates of the chip and uses liquid flow to remove heat inside the chip, …