Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 8 of 8 for “"Thermocompression bonding"”.
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Mechanics aspects of water thermocompression bonding
Wafer-level, thermocompression bonding is a promising technique for microelectromechanical systems (MEMS) packaging. The process is a form of solid-state joining and requires the simultaneous application of temperature and pressure to wafers patterned with metallic thin films in order to bring the …
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Fabrication and characterization of wafer-level gold thermocompression bonding
… This thesis explores a low temperature wafer bonding technique: thermocompression bonding. This technique relies on the applied pressure and temperature to forge a bond. The pressure brings two surfaces into close proximity while the temperature reduces the pressure requirement to deform the …
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Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Wafer bonding is a key process and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced interconnect delay and correspondingly increased circuit speed and decreased power dissipation, along with an improved form factor and portability. One of the most …
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Multilayer Micromachined RF MEMS Filters at Ka and L/S Band For On-Board Satellite Communication Systems
… critical fabrication steps like wafer to wafer thermocompression bonding using gold (Au) and silver (Ag) as an intermediate layer and fabrication of Through Silicon Vias (TSV).
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Three dimensional integration technology using copper wafer bonding
… were the following: Low temperature Cu-Cu thermocompression bonding, an aluminum-Cu based temporary laminate structure used stabilizing the handle wafer - SOI wafer bond, and tooling optimization of the die-die bonder setup in TRL.
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Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits
… density per unit chip area. Wafer-level Cu-Cu thermocompression bonding provides an attractive route to 3D IC fabrication, with Cu serving as both the electrical and mechanical interconnection between adjacent device layers. While the bonding process is currently employed for such applications, …
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The Mathematical Modelling of Electrical and Thermal Acceleration Factors in VLSI Conductors
… layer suitable for wire or tape ultrasonic-thermocompression bonding, usually involving aluminium or gold, or soldering using lead-tin alloys. When a semiconductor device is fabricated, it goes through a number of processes at the end of which it is metallized, passivated, encapsulated, and …
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Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect
Semiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be formed between the chips with through-silicon-vias …