Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 8 of 8 for “"Thermo-mechanical reliability"”.
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Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization
This thesis presents reliability analysis of indium interconnects and Under Bump Metallization (UBM) in flip chip devices. Flip chip assemblies with the use of bump interconnections are frequently used, especially in high density, three-dimensional electronic devices. Currently there are many …
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Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices
This study mainly evaluated the thermo-mechanical reliability of lead-free packaging techniques for attaching large-area chip. With 3 MPa pressure, a low-temperature (<300oC) sintering technique enabled by a nano-scale silver paste was developed for attaching 100 mm2 silicon die. This new lead-free …
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Optimised solder interconnections in crystalline silicon (c-Si) photovoltaic modules for improved performance in elevated temperature climate
… Africa and the Middle East are plagued with poor thermo-mechanical reliability and short fatigue lives. There is the need to improve the performance of the system operating in such regions to solve the grave energy poverty and power shortages. Solder interconnection failure due to accelerated …
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Study of photovoltaic (PV) module interconnections failure analysis and reliability
… R&D challenge for improving the performance and reliability of PV modules has become an urgent and critical agenda for the energy generation industry sector. The interconnection between the solar PV cells is a very important part of the PV module assembly, and its failure can adversely affect the …
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Analysis of column interconnects for wafer level packages
This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
… assembly. They serve as both the electrical and mechanical connections between surface mount component and the substrate. This function is crucial in Surface Mount Technology (SMT) owing to its capability in supporting the realisation of high density, functionality and performance of electronic …
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Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction
… of solar cells in the modules due to accelerated thermo-mechanical degradation. The goal of this research is to provide adequate information for proper design of solar cell solder joint against fatigue failure through the study of cyclic thermo-mechanical stresses and strains in the joint. This is …
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Design and Development of High Density High Temperature Power Module with Cooling System
… converters to higher power density. However, the reliability of the SiC semiconductor is still under investigation, and at the same time, the standard Si device packages do not meet the requirement of high temperature operation. In order to take full advantage of SiC semiconductor devices, high …