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Showing 1 to 1 of 1 for “"Thermal Through Silicon Vias (TTSV)"”.
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Refresh reduction in dynamic memories
… 3D processor-memory stacks. We propose the Xylem Thermal Through Silicon Via (TTSV) placement schemes, to reduce the temperature of the DRAM dies and the processor die in the stack. The TTSV placement should respect the DRAM array structure and handle unknown multicore hotspots. The resulting …