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Showing 1 to 13 of 13 for “"Thermal Interface Material"”.

  1. Analysis and simulation of carbon-based thermal interface material

    The student, Michael Jo, submitted this Dissertation for approval on 2018-07-11 at 12:35.

    uiuc Repository record for Analysis and simulation of carbon-based thermal interface material (opens in a new tab)

  2. Wear-resistant thermal interface material (TIM) for quad/octal small form factor pluggable (QSFP/OSFP) modules

    Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-08-01

    uiuc Repository record for Wear-resistant thermal interface material (TIM) for quad/octal small form factor pluggable (QSFP/OSFP) modules (opens in a new tab)

  3. On-Chip Isotropic Microchannels for Cooling Three Dimensional Microprocessors

    … number of 525. These channels also have a lower thermal resistance compared to external heat sinks because there is no heat spreader or thermal interface material layer.

    vt Repository record for On-Chip Isotropic Microchannels for Cooling Three Dimensional Microprocessors (opens in a new tab)

  4. Convection and Flow Boiling in Microgaps and Porous Foam Coolers

    … component and which eliminates the problematic thermal resistance of the commonly-used thermal interface material (TIM), is examined. The single phase heat transfer and pressure drop results of water are used to validate a detailed numerical model and, together with the convective FC-72 data, …

    maryland Repository record for Convection and Flow Boiling in Microgaps and Porous Foam Coolers (opens in a new tab)

  5. Characterizing the Thermal Behavior of Pyrolytic Graphite Sheets (PGS) at Low Interface Pressures

    … has led the Navy to pursue the design of a dry interface liquid cooling system to cool the iPEBB. This means that no liquid can cross the boundary of the iPEBB and thus the cooling system must be separate. In this thesis, an integral portion of the dry interface cooling solution, the thermal

    mit Repository record for Characterizing the Thermal Behavior of Pyrolytic Graphite Sheets (PGS) at Low Interface Pressures (opens in a new tab)

  6. System Design, Fabrication, and Characterization of Thermoelectric and Thermal Interface Materials for Thermoelectric Devices

    … endeavors have been made to design and fabricate materials with a higher dimensionless thermoelectric figure of merit (ZT), as well as to optimize the device structure and packaging to manage heat more effectively. When evaluating candidate thermoelectric materials, one must accurately …

    vt Repository record for System Design, Fabrication, and Characterization of Thermoelectric and Thermal Interface Materials for Thermoelectric Devices (opens in a new tab)

  7. The Design and Manufacture of a Light Emitting Diode Package for General Lighting

    … form of lighting and do not contain hazardous materials. Unfortunately, LEDs pose unique problems because advanced thermal management is required to remove the high heat fluxes generated by such relatively small devices. These problems have already been overcome with complex packaging and …

    calpoly Repository record for The Design and Manufacture of a Light Emitting Diode Package for General Lighting (opens in a new tab)

  8. Packaging of Enhancement-Mode Gallium Nitride High-Electron-Mobility Transistors for High Power Density Applications

    … concern with GaN HEMTs comes from their lower thermal conductivity and smaller die size. The HEMTs generally have a higher heat flux density, and accordingly, demand better heat dissipation. Thus, innovations are needed for making GaN HEMT packages with low parasitic inductances and higher …

    vt Repository record for Packaging of Enhancement-Mode Gallium Nitride High-Electron-Mobility Transistors for High Power Density Applications (opens in a new tab)

  9. De-risking thermal management challenges in automotive vehicles: oil circulation and thermal contact resistance

    Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-05-01

    uiuc Repository record for De-risking thermal management challenges in automotive vehicles: oil circulation and thermal contact resistance (opens in a new tab)

  10. Two-dimensional Mapping of Interface Thermal Resistance by Transient Thermal Impedance Measurement

    Interconnects in power module result in thermal interfaces. The thermal interfaces degrade under thermal cycling, or chemical loading. Moreover, the reliability of thermal interfaces can be especially problematic when the interconnecting area is large, which increases its predisposition to generate …

    vt Repository record for Two-dimensional Mapping of Interface Thermal Resistance by Transient Thermal Impedance Measurement (opens in a new tab)

  11. Advanced Thermal Management Strategies – Scalable Coal-Graphene based TIMs and Additively Manufactured Heat Sinks

    … and high performance in electronics, thermal management is a very important area of research today. In multiple applications such as portable electronics, consumer electronics, military applications, automobile, power electronics, high performance computing, etc. innovative thermal

    vt Repository record for Advanced Thermal Management Strategies – Scalable Coal-Graphene based TIMs and Additively Manufactured Heat Sinks (opens in a new tab)

  12. Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling

    … composite spreaders. These spreaders removed the thermal power dissipated by a 20 x 20 mm microprocessor with and without hot spots, by saturation nucleate boiling of PF-5060. To ensure the consistency of the experimental results, all pool boiling experiments reported in this dissertation are for …

    unm Repository record for Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling (opens in a new tab)