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Showing 1 to 7 of 7 for “"Thermal Anneal"”.

  1. Heating it up: a novel approach to annealing soluble organic semiconductors

    … which is used as the gate. A 400nm thick thermally grown oxide is used to insulate the semiconductor gate from the Ti/Au source and drain leads. The as-deposited TES-ADT film is amorphous, and recent work by the Anthony group at the University of Kentucky has shown that this film can be …

    unsw Repository record for Heating it up: a novel approach to annealing soluble organic semiconductors (opens in a new tab)

  2. Cobalt silicide characterization

    … spiking, void formation, sheet resistivity, thermal stability, and agglomeration. There are four process variables in this study: the first rapid thermal anneal (RTA) temperature and ramp rate, the Co and TiN removal time, and the second RTA temperature. (Abstract shortened by UMI.).

    unlv Repository record for Cobalt silicide characterization (opens in a new tab)

  3. Advanced process development for contacts to algan/gan high electron mobility transistors (HEMTS)

    … of the Schottky diodes was evaluated and their thermal stability also was studied. The interposition of Pt in Ni/Au and Ir/Au systems was found to improve the characteristics of the Schottky diodes. Ir/Pt/Au diodes were found to be more thermally stable than Ni/Pt/Au diodes. Ni/Au Schottky …

    uiuc Repository record for Advanced process development for contacts to algan/gan high electron mobility transistors (HEMTS) (opens in a new tab)

  4. Magneto-optical and multiferroic oxide thin films, integrated nonreciprocal photonic devices and multiferroic memory devices

    … = 1550 nm for all substrate orientations). The thermal budgets of Ce: YIG growth on ShN4 (2 high temperature PLD steps and a rapid thermal anneal, RTA), silicon-on-insulator substrates (a high and a low temperature PLD step and a RTA) and optical resonator chips (one PLD step, one RTA, YIG seed …

    mit Repository record for Magneto-optical and multiferroic oxide thin films, integrated nonreciprocal photonic devices and multiferroic memory devices (opens in a new tab)

  5. Microstructural Analysis of Garnet-Heavy Metal Heterostructures

    … grown on Si with PMA due to an external rapid thermal anneal after pulsed laser deposition [8]. However, crystallization is limited to thicknesses above 20 nm. Furthermore, Pt is often used as a heavy metal for investigating interfacial phenomena in REIGs [9,10,11]. However, the REIG film …

    mit Repository record for Microstructural Analysis of Garnet-Heavy Metal Heterostructures (opens in a new tab)

  6. Investigations of ultra shallow junction ion implanted biaxial tensile strained silicon by means of X-Ray, Raman and photoacoustic techniques

    … to low energy antimony implants and low thermal budget rapid thermal anneal (RTA), for the production of ultrashallow, abrupt junctions, appropriate for future generation source-drain extensions (SDE). Examined in the wider project are the effects of strain on dopant activation and …

    dcu Repository record for Investigations of ultra shallow junction ion implanted biaxial tensile strained silicon by means of X-Ray, Raman and photoacoustic techniques (opens in a new tab)

  7. Gate-all-around silicon nanowire MOSFETs : top-down fabrication and transport enhancement techniques

    … strain engineering and maskless hydrogen thermal annealing are investigated in this thesis to enhance carrier mobility in gate-all-around nanowire MOSFETs. Uniaxial tensile stress of about 2 GPa was incorporated for the first time into suspended Si nanowire channels by a novel lateral …

    mit Repository record for Gate-all-around silicon nanowire MOSFETs : top-down fabrication and transport enhancement techniques (opens in a new tab)