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Showing 1 to 1 of 1 for “"Test wrapper design"”.
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Design for pre-bond testability in 3D integrated circuits
… that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is …