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Showing 1 to 6 of 6 for “"TaSiN"”.
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Identification of Small Molecule Inhibitors Targeting Truncated Adenomatous Polyposis Coli (APC) as a Novel Therapeutic Strategy in Colorectal Cancer
… truncated APC. We identified a compound, TASIN-1(Truncated APC Selective Inhibitor-1), which showed selective cytotoxicity towards HCECs and colorectal cancer (CRC) cells with APC truncations. TASIN-1 induces apoptotic cell death in APC truncated cells and its effect is independent of …
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Identification of Small Molecule Inhibitors Targeting Truncated Adenomatous Polyposis Coli (APC) as a Novel Therapeutic Strategy in Colorectal Cancer
… truncated APC. We identified a compound, TASIN-1(Truncated APC Selective Inhibitor-1), which showed selective cytotoxicity towards HCECs and colorectal cancer (CRC) cells with APC truncations. TASIN-1 induces apoptotic cell death in APC truncated cells and its effect is independent of …
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TEM-Untersuchungen zum Gefüge und zu mechanischen Spannungen in Metallisierungen für SAW-Bauelemente
… metallizations. The Cu based metallizations with TaSiN diffusion barriers were also investigated in this work. The barrier layers are necessary to impede the oxygen diffusion into the Cu layer and the Cu diffusion into the piezoelectric substrate. Also in this work the analytical TEM were used as …
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Metal seed deposition from organic solutions for subsequent electroless plating
… parameters. Different substrates like TiSiN and TaSiN, were evaluated for use with the organic solutions. High density and uniform metal crystal layers of Pd and Cu were successfully deposited on the substrate surface. Characterization of the deposited seed particles verified that pure metal seed …
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Diffusion Barriers/Adhesion Promoters. Surface and Interfacial Studies of Copper and Copper-Aluminum Alloys
… copper with oxidized tantalum silicon nitride (O/TaSiN) is characterized. The data indicate that initial copper depositions result in the formation a conformal ionic layer followed by Cu(0) formation in subsequent depositions. Post-deposition annealing experiments performed indicate that although …
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Tantalum- and ruthenium-based diffusion barriers/adhesion promoters for copper/silicon dioxide and copper/low κ integration.
… to those previously reported for air-exposed TaSiN, and indicate that Si-modified Ta barriers should maintain Cu wettability under oxidizing conditions for Cu interconnect applications. XPS has been used to study the reaction of tert-butylimino tris(diethylamino) tantalum (TBTDET) with atomic …