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Showing 1 to 2 of 2 for “"TTSV"”.

  1. Refresh reduction in dynamic memories

    … propose the Xylem Thermal Through Silicon Via (TTSV) placement schemes, to reduce the temperature of the DRAM dies and the processor die in the stack. The TTSV placement should respect the DRAM array structure and handle unknown multicore hotspots. The resulting temperature distribution still …

    uiuc Repository record for Refresh reduction in dynamic memories (opens in a new tab)

  2. Thermal designs, models and optimization for three-dimensional integrated circuits

    … to existing thermal through- silicon via (TTSV). We analyze design requirements of thermal fin for single TTSV as well as TTSV cluster designs with the goal of maximizing heat dissipation while minimizing the interference with routing and area consumption. An analytical model of the …

    uiuc Repository record for Thermal designs, models and optimization for three-dimensional integrated circuits (opens in a new tab)