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Showing 1 to 4 of 4 for “"System on package"”.

  1. Microwave CMOS VCOs and Front-Ends - using integrated passives on-chip and on-carrier

    … for high data rates in wireless communication systems is increasing the requirements on the transceiver front-ends, as they are pushed to utilize more and wider bands at higher frequencies. The work in this thesis is focused on receiver front-ends composed of Low Noise Amplifiers (LNAs), …

    lund Repository record for Microwave CMOS VCOs and Front-Ends - using integrated passives on-chip and on-carrier (opens in a new tab)

  2. Predicting performance parameters of analog and mixed-signal circuits using built-in and built-off self test

    … widespread use of embedded mixed-signal cores in system-on-chip (SoC) or System-on-Package (SoP) design has been increasingly important in cost-effective manufacturing test for mixed-signal devices. A typical SoP encapsulates many of its internal functions, and its production test is performed by …

    texas Repository record for Predicting performance parameters of analog and mixed-signal circuits using built-in and built-off self test (opens in a new tab)

  3. Exploration of liquid crystal polymer packaging techniques for rf wireless systems

    … in low-cost, low-power, high data rate wireless systems for both commercial and defense applications. Some of these include air defense systems, remote sensing radars, and communication systems that are used for unmanned aerial vehicles, ground vehicles, and even the individual consumer. All of …

    gatech Repository record for Exploration of liquid crystal polymer packaging techniques for rf wireless systems (opens in a new tab)