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Showing 1 to 1 of 1 for “"System in a Package"”.
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Charged device model electrostatic discharge failures in system on a chip and system in a package designs
Advances in integrated circuit design and packaging techniques have introduced new ESD-susceptible (Electrostatic Discharge) circuit interfaces. This document will introduce these interfaces and the methods that were used to investigate their ESD robustness. Two test chips were designed to aid the …