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Showing 1 to 13 of 13 for “"Surface Mount Technology"”.
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Analysis of surface mount technology solder joints
The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex. The exploration of these factors, and how they may affect the reliability and quality of the joints can only be achieved through continuous research. In this project, essential areas of …
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A modular supply chain architecture for low-volume high-mix surface mount technology manufacturers
Thesis (S.M.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; in conjunction with the Leaders for Manufacturing Program at MIT, 2002.
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Impact of shipping Ball-Grid-Array Notebook processors in tape and reel on the PC supply chain
… a more efficient pick and place process on their surface mount technology (SMT) lines compared to when using trays. However, from Intel's standpoint, BGA CPUs have a very high product mix, and shipping BGA CPUs in trays allows Intel to ship in smaller order quantities to customers. Intel currently …
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Numerical analysis of surface mount electronics with viscoelastic epoxy underfills and potting
Surface mount technology is quite common in modern electronics industry. In some instances, printed circuit boards (PCBs) have been encapsulated in foam or epoxy to improve survivability. When packaging PCBs to survive operational environments, it is important to understand the stresses and strains …
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Development of control system to automate the PCB pin insertion process
… runs the automated pin insertion machine in a surface mount technology assembly line. The control system is divided into 2 subsystems viz. pin sorting and pin insertion. The detailed design of the control system and its components is discussed, along with the programming of the Programmable …
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Tuning and parameter optimization of a digital integral controller for uniform droplet spray applications using lead-free tin-copper solder
… solder spheres for wafer bumping and other surface mount technology. Operation improvements were made upon a uniform droplet spray apparatus, and its digital integral controller was tuned for application to lead-free solder. Parameters determined included a range of initial controller …
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Surface mounted PCB cleaning process improvement and Its impact on manufacturing system performance
In the surface mount technology (SMT) assembly line, the printed circuit boards (PCB) are washed to remove the solder flux that was used while soldering to prevent oxidation. However the current cleaning method is highly ineffective in removing these solder flux residues. The solder flux residues …
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Development of an electrical impedance tomograph for complex impedance imaging
… novel circuit. In order to aid system testing, a surface mount technology resistor-mesh test object was produced. This has been adopted by the EEC Concerted Action on Impedance Tomography (CAIT) programme as the first standard test object. A computer model of the phantom was produced using the …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
… electrical and mechanical connections between surface mount component and the substrate. This function is crucial in Surface Mount Technology (SMT) owing to its capability in supporting the realisation of high density, functionality and performance of electronic devices. With the increase in …
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HARMONIC AND RANDOM VIBRATION DURABILITY INVESTIGATION FOR SAC305 (Sn3.0Ag0.5Cu) SOLDER JOINT
… more complex and has been less investigated. In surface mount technology, solder joints are the primary mechanical, thermal and electrical interconnects between the component and the PWB. So the reliability of solder joints is very crucial for most electronic assemblies. The vibration durability …
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On-line non-destructive ultrasonic rheology measurement of solder pastes
In surface mount technology (SMT) electronics assembly, the solder paste is printed onto the PCB's surface through a stencil and the components are later placed over the solder paste deposits. Since 2007, the use of extremely small SMT components for assembly of SMT devices has been widespread, and …
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Low Volume Dispensing with High Speed Dispensers
<p>With the high pace of innovation in the semiconductor manufacturing industry, there has been an increasing demand for more energy efficient and environmental friendly products. This research relates to a complex process of fluid dispensing at low volumes on a printed circuit board. Currently, a …