Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 46 for “"Surface Mount"”.
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Analysis of surface mount technology solder joints
The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex. The exploration of these factors, and how they may affect the reliability and quality of the joints can only be achieved through continuous research. In this project, essential areas of …
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Modeling and simulation of surface mount packages
… performance evaluation of plastic packages for surface mount devices. Of particular interest in this work are packages for use in the gigahertz range. In order to accurately model these packages, time and frequency domain measurements of two different packaged structures are performed. …
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Numerical analysis of surface mount electronics with viscoelastic epoxy underfills and potting
Surface mount technology is quite common in modern electronics industry. In some instances, printed circuit boards (PCBs) have been encapsulated in foam or epoxy to improve survivability. When packaging PCBs to survive operational environments, it is important to understand the stresses and strains …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
… electrical and mechanical connections between surface mount component and the substrate. This function is crucial in Surface Mount Technology (SMT) owing to its capability in supporting the realisation of high density, functionality and performance of electronic devices. With the increase in …
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Cleaning process development and optimization in the surface mount assembly line of power modules
The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that …
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A modular supply chain architecture for low-volume high-mix surface mount technology manufacturers
Thesis (S.M.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; in conjunction with the Leaders for Manufacturing Program at MIT, 2002.
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Design and development of an automated pinning machine for the surface mount electronics industry
… odd-form pins specific to a company in the surface mount electronics industry. The developed pinning machine will reduce manual labor requirements, increase flexibility over current automated systems, and allow for greater part traceability. A brief history of industrial automation is …
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Development of a seamlessly integrated factory planning software tool (prototype) to evaluate and optimize surface mount manufacturing lines
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1995.
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3D Commutation-Loop Design Methodology for a SiC Based Matrix Converter run in Step-up mode with PCB Aluminum Nitride Cooling Inlay
… This layout is more easily achievable with a surface-mount device package, which also offers benefits such as ease in manufacturing, and a compact package. In order to implement a surface-mount device, a PCB thermal management strategy should be utilized. An evaluation of these methods is also …
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Impact of shipping Ball-Grid-Array Notebook processors in tape and reel on the PC supply chain
… a more efficient pick and place process on their surface mount technology (SMT) lines compared to when using trays. However, from Intel's standpoint, BGA CPUs have a very high product mix, and shipping BGA CPUs in trays allows Intel to ship in smaller order quantities to customers. Intel currently …
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Locating SMD's for automatic inspection
… problems involved in the inspection of SMD’s (Surface Mount Devices) and to propose algorithms for their solution. First, a short introduction to the area of research and a motivation for this work is given. Second, the components of a vision system, its capabilities, and its limitations are …
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Effect of temperature on the fracture behavior of lead-free solder joints
… two copper bars, fabricated under standard surface mount (SMT) processing conditions are fractured under various temperatures with a MTS machine equipped with an environment chamber. The load-displacement behavior corresponding to crack initiation and the subsequent toughening before …
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Development of control system to automate the PCB pin insertion process
… runs the automated pin insertion machine in a surface mount technology assembly line. The control system is divided into 2 subsystems viz. pin sorting and pin insertion. The detailed design of the control system and its components is discussed, along with the programming of the Programmable …
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Reverse-engineering RLC networks with in-circuit measurement
… measurement issues were found. A technique for surface-mount soldering breadboards to PCBs is presented in this thesis.
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Tuning and parameter optimization of a digital integral controller for uniform droplet spray applications using lead-free tin-copper solder
… solder spheres for wafer bumping and other surface mount technology. Operation improvements were made upon a uniform droplet spray apparatus, and its digital integral controller was tuned for application to lead-free solder. Parameters determined included a range of initial controller …
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Surface mounted PCB cleaning process improvement and Its impact on manufacturing system performance
In the surface mount technology (SMT) assembly line, the printed circuit boards (PCB) are washed to remove the solder flux that was used while soldering to prevent oxidation. However the current cleaning method is highly ineffective in removing these solder flux residues. The solder flux residues …
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Design of a container for the collection of solder balls produced by the Uniform Droplet Spray (UDS) process
… Ball Grid Array (BGA) packaging, a type of surface mount package, provides more 1/0 connections while increasing the reliability and decreasing the size of the electronics component. BGA packaging is an interconnection technology that uses an array of small uniform solder balls as the …
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A Damped Double Dipole UHF RFID Antenna with Application to Wireless Chemiresistive Gas Sensing
… of operation is validated experimentally with surface mount resistors, showing a relative change in 𝜏 of 0.2 for a 35% change in resistance of the sensing element. Then, a printing process is developed for liquid inks comprising CNTs, and RFID tags are fabricated with functionalized CNTs as the …
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