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Showing 1 to 1 of 1 for “"Solder and soldering--Cracking--Mathematical models"”.

  1. Numerical study of solder joint failure under fast loading conditions

    … study was undertaken to investigate the solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model was incorporated into the …

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