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Showing 1 to 3 of 3 for “"Solder and soldering"”.
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Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages
… enables increased device density per volume and improved electrical performance through short vertical interconnect paths. Mechanical reliability of 3D IC packages is critical due to the widespread use of electronic devices. Misalignment induced shear deformation of the through-silicon vias …
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Effects of underfill material on solder deformation and damage in 3D packages
… introduction of a periodic boundary condition and the presence of underfill material on the stress and strain fields and evolution of failure of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed between two silicon substrates in contact …
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Numerical study of solder joint failure under fast loading conditions
… study was undertaken to investigate the solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model was incorporated into the …