Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 36 for “"Solder Joint"”.
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Non-destructive evaluation of solder joint reliability
… evaluation technique is presented in which a key solder joint feature, nucleating at the bump to silicon interface and propagating across a laminar crack plane is captured and tracked using acoustic microscopy imaging (AMI). The feasibility of this concept was successfully demonstrated by …
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Testing and inverse modelling for solder joint reliability assessment
… of slowing down, the reliability of lead free solder joints with diminishing size has become more and more a challenge to the design engineers and the electronics manufacturing industry. In order to predict the reliability of solder joints accurately, it is necessary to develop test techniques …
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Numerical study of solder joint failure under fast loading conditions
… study was undertaken to investigate the solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model was incorporated into the …
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HARMONIC AND RANDOM VIBRATION DURABILITY INVESTIGATION FOR SAC305 (Sn3.0Ag0.5Cu) SOLDER JOINT
… less investigated. In surface mount technology, solder joints are the primary mechanical, thermal and electrical interconnects between the component and the PWB. So the reliability of solder joints is very crucial for most electronic assemblies. The vibration durability of Pb-free solder joints …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
… techniques. On the other hand, advanced solder joint area-array technologies, such as flip-chip technology, has emerged in microelectronics industry due to increased speed, higher packaging density, and performance, improved reliability and low cost these technologies offer. With all …
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Effects of underfill material on solder deformation and damage in 3D packages
… of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed between two silicon substrates in contact with through-silicon vias without any other devices or components attached. Differing solder joint thicknesses, both with and without …
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Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction
… has been the untimely fatigue failure of solder interconnections of solar cells in the modules due to accelerated thermo-mechanical degradation. The goal of this research is to provide adequate information for proper design of solar cell solder joint against fatigue failure through the …
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Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. …
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Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints
Solder joints play a very important role in electronic products as the integrity of electronics packaging and assembly rests on the quality of these connections. The increasing demands for higher performance, lower cost, and miniaturisation in hand-held and consumer electronic products have led to …
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Analysis of column interconnects for wafer level packages
This thesis focuses on the solder joint thermo-mechanical reliability analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
Solder joints have been an integral part of any electronic assembly. They serve as both the electrical and mechanical connections between surface mount component and the substrate. This function is crucial in Surface Mount Technology (SMT) owing to its capability in supporting the realisation of …
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Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices
… technique for die-attachment was compared with soldering by vacuum reflow. Lead-free solder SAC305 and SN100C were selected and used in this work since they were widely used in electronic packaging industry. Inspection of as-prepared die-attachments by X-ray and optical microscopy (observation …
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Design and Analyses of a Dimple Array Interconnect Technique for Power Electronics Packaging
… connections onto the devices are achieved by solder bumps formed between the silicon device and arrays of dimples stamped on a metal sheet flex. This research first presents the design of the materials, electrical and thermal performance, reliability, and the fabrication process of the DAI. It …
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Study of photovoltaic (PV) module interconnections failure analysis and reliability
… to the crack initiation and propagation in the solder joints used to connect the ribbon interconnection to the cell. This research focuses on the study of the thermal failure of PV module solder joint to determine the optimum ribbon interconnection designs that will give improved …
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Predicting adhesive failure initiation of an epoxy bond for electronic packaging survivability
… implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. Data from epoxy bond failure in mock …
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ADVANCED STATISTICAL ANALYSIS FOR TAIL-END PROBABILITY PREDICTION AND PERFORMANCE RESPONSE CALCULATION OF SEMICONDUCTOR PACKAGING PRODUCTS WITH A LARGE NUMBER OF INPUT VARIABLES
… statistical variations of warpages as well as solder ball and joint heights. The goal is achieved by employing (1) advanced approximate integration-based approach, called eigenvector dimension reduction (EDR) method, for the UP analysis; (2) the stress-strength interference (SSI), and (3) the …
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Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages
… of the through-silicon vias (TSV) and solder micro-bumps are simulated through an applied shearing action. Thermal effects due to coefficient of thermal expansion (CTE) mismatch during processing are also studied to provide trends of stress and deformation fields. Reliability of the 3D …
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Design of a high performance liquid-cooled lithium-ion battery pack for automotive applications
… cell. A novel design is proposed, implementing soldering the negative terminal of electroplated 18650 battery cells directly to a metal core printed circuit board material as the critical cell-to-water interface that provides high thermal conductivity while maintaining electrical isolation. Cold …
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Modelling to predict the reliability of solder joints
… modelling methods to predict the reliability of solder joints under thermo-mechanical cycling. A literature review is presented covering analytical methods, creep laws and fatigue laws, and advanced damage mechanics methods. The use of FEA (Finite Element Analysis) to model creep along with a …
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Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints
… which may challenge the limits of present soldering technology. The reliability of solder joints is a concern because fracture failures in solder joints accounts for 70% of failures in electronic components. Lead-free solders are being investigated as replacements for lead solders currently …
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