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Showing 1 to 6 of 6 for “"Solder Bump"”.
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Effects of surface properties on solder bump formation by direct droplet deposition
… processes have made it possible to directly form solder bumps on integrated circuits using micron-sized molten metal droplets. The direct droplet deposition bumping process can potentially produce uniform-sized bumps more economically than the existing processes such as plating and stencil …
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Numerical Study For Acoustic Micro-Imaging Of Three Dimensional Microelectronic Packages
… the modelling of a flip chip with a 140µm solder bump assembly, which is implemented with a 230MHz virtual raster scanning transducer with a spot size of 17µm. The Virtual Transducer was designed to reduce the total numerical elements from hundreds of millions to hundreds of thousands. …
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Precision Self -Alignment Techniques for Optoelectronic Integration
… accuracies have been achieved using solder bump arrays for component alignment and etched V-grooves for optical fiber alignment. The self-alignment potential of eutectic tin-silver solder bump arrays to produce sub-quarter-micron alignment precision is demonstrated. The potential for …
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UBM Formation on Single Die/Dice for Flip Chip Applications
… for Flip Chip applications. The UBM (Under Bump Metallurgy) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and the bumps. Typically, UBM is deposited on the whole wafers …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
… techniques. On the other hand, advanced solder joint area-array technologies, such as flip-chip technology, has emerged in microelectronics industry due to increased speed, higher packaging density, and performance, improved reliability and low cost these technologies offer. With all …
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Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
… of planar structures, the direct bond and the bump bond, to the high-temperature packaging of high-temperature SiC diode. A drop in the reverse breakdown voltage was discovered in the packaging using a direct bond. The root cause for the drop in the breakdown voltage was identified and …