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Showing 1 to 1 of 1 for “"Sn-based materials"”.
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Indentation vs. Uniaxial Power-law Creep of Sn-based Solder Material: A Numerical Assessment
… (in K). Characterization of small-volume materials has been primarily relying on the method of indentation. The topic of concern in this study is the relationship between indentation creep and uniaxial power-law creep. Two stages of numerical simulation were involved, the first a uniaxial …