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Showing 1 to 11 of 11 for “"Single Die"”.

  1. UBM Formation on Single Die/Dice for Flip Chip Applications

    … process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallurgy) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and …

    vt Repository record for UBM Formation on Single Die/Dice for Flip Chip Applications (opens in a new tab)

  2. Charged device model electrostatic discharge failures in system on a chip and system in a package designs

    … on the intensity of the CDM stress based on single-die or stacked-die packages will be compared.

    uiuc Repository record for Charged device model electrostatic discharge failures in system on a chip and system in a package designs (opens in a new tab)

  3. Substrate noise analysis and techniques for mitigation in mixed-signal RF systems

    … between analog and digital systems on a single die are one such challenge. Switching transients induced by digital circuits inject noise into the common substrate creating substrate noise. Analog circuits lack the large noise margins of digital circuits, thus making them susceptible to …

    mit Repository record for Substrate noise analysis and techniques for mitigation in mixed-signal RF systems (opens in a new tab)

  4. A test structure for the measurement and characterization of layout-induced transistor variation

    … of transistors can now be integrated onto a single die. However, this trend also magnifies the significance of device variability. In this thesis, we focus on the study of layout-induced systematic variation. Specifically, we investigate how pattern densities can affect transistor behavior. …

    mit Repository record for A test structure for the measurement and characterization of layout-induced transistor variation (opens in a new tab)

  5. A many-core software framework for embedded space computing

    … The emergence of many-core CPUs on a single die provides one potential solution. The development of processors like Maestro strives for the balance between computational power and energy efficiency. However, development in software has not kept up. Not a single dominant programming …

    mit Repository record for A many-core software framework for embedded space computing (opens in a new tab)

  6. Monolithic electronic-photonic integration in state-of-the-art CMOS processes

    … and energy efficiency of computation on a single chip, the off-chip communication link to memory has emerged as the major bottleneck within modern processors. Photonic devices promise to break this bottleneck with superior bandwidth-density and energy-efficiency. Initial work by many …

    mit Repository record for Monolithic electronic-photonic integration in state-of-the-art CMOS processes (opens in a new tab)

  7. Evaluation Techniques for Mapping IPs on FPGAs

    … the availability of billions of transistors on a single die. The time-to-design is shrinking continuously due to aggressive competition. Also, the integration of many discrete components on a single chip is growing at a rapid pace. Designing such heterogeneous systems in short duration is becoming …

    vt Repository record for Evaluation Techniques for Mapping IPs on FPGAs (opens in a new tab)

  8. Fully Integrated Wireless Power Transfer System For Biomedical Applications

    … coil (Rx) and power shaping circuits on a single chip in a standard CMOS process with no additional post-processing steps or external components. This thesis investigates the feasibility of a fully integrated WPT system that is capable of wirelessly providing milliwatts of power at …

    toronto-retro Repository record for Fully Integrated Wireless Power Transfer System For Biomedical Applications (opens in a new tab)

  9. A Study of the Application of Low Frequency Oscillations to Multi-Tool Drawing Processes

    … Results show that when wire is drawn through two dies in tandem which are oscillated axially and in anti-phase; or when tube is drawn through the annular gap between a die and a fixed plug which are oscillated axially in antiphase: (a) The workpiece moves relative to the tools for a short period …

    aston Repository record for A Study of the Application of Low Frequency Oscillations to Multi-Tool Drawing Processes (opens in a new tab)

  10. Direct Back EMF Detection Method for Sensorless Brushless DC (BLDC) Motor Drives

    … and motor control peripherals integrated on a single die. A microcontroller-based sensorless BLDC drive system has been developed as well, which is suitable for various applications, including hard disk drive, fans, pumps, blowers, and home appliances, etc.

    vt Repository record for Direct Back EMF Detection Method for Sensorless Brushless DC (BLDC) Motor Drives (opens in a new tab)

  11. Interconnection systems for highly integrated computation devices

    … increasing numbers of computation units onto a single die. The resulting outcome, especially in the embedded domain, has often been called SYSTEM-ON-CHIP (SOC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MPSOC). MPSoC design brings to the foreground a large number of challenges, one of the most prominent …

    bologna Repository record for Interconnection systems for highly integrated computation devices (opens in a new tab)