Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 9 of 9 for “"Simultaneous switching noise"”.
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Mitigation of simultaneous switching noise by active rail clamps
Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2025-10-20 without embargo terms
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Allocating decoupling capacitors to reduce simultaneous switching noise on chips
L dI/dt noise due to simultaneous switching of circuits on chips is a growing problem in VLSI design. This kind of noise can lead to timing errors and significant circuit slowdowns, if not kept within reasonable bounds. The most common way of reducing this form of noise is the addition of …
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Application of electromagnetic-bandgap structures to power distribution network design
… bandgap structure which suppresses the simultaneous switching noise in a power distribution network. By accommodating a metalized periodic pattern on either power or ground plane, the performance of multilayer digital circuit boards can be enhanced with minimized electromagnetic …
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Analysis of MOS Current Mode Logic (MCML) and Implementation of MCML Standard Cell Library for Low-Noise Digital Circuit Design
<p>MOS current mode logic (MCML) offers low noise digital circuits that reduce noise that can cripple analog components in mixed-signal integrated circuits, when compared to CMOS digital circuits. An MCML standard cell library was developed for the Cadence Virtuoso Integrated Circuit (IC) design …
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The Dual Use of Power Distribution Networks for Data Communications in High Speed Integrated Circuits
… signaling is selected due to its robustness to noise and wideband characteristics. Next, we study a planar structure IC package based on the cavity resonator model (CRM) as a communication channel. Impedance characteristics of a planar structure IC package and other relevant components of an IC …
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Power distribution network modeling and microfluidic cooling for high-performance computing systems
… microfluidic vias and heat sinks, and simultaneous flip-chip bonding of the electrical and fluidic microbumps, are developed and demonstrated. Fine-pitch electrical microbumps of 25 µm diameter and 50 µm pitch, fluidic vias of 100 µm diameter, and annular-shaped fluidic microbumps of …
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Models predicting the performance of IC component or PCB channel during electromagnetic interference
… of jitter due to crosstalk and due to simultaneous switching noise, and covers susceptibility of delay locked loop (DLL) to electromagnetic interference.</p> <p>In the first paper, an improved tail-fit de-convolution method is proposed for characterizing the impact of deterministic …
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Modeling and simulation for signal and power integrity of electronic packages
The objective of this dissertation is to develop electrical modeling and co-simulation methodologies for signal and power integrity of package and board applications. The dissertation includes 1) the application of the finite element method to the optimization for decoupling capacitor selection and …