Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 4 of 4 for “"Silver joint"”.
-
Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices
… sintering technique enabled by a nano-scale silver paste was developed for attaching 100 mm2 silicon die. This new lead-free packaging technique for die-attachment was compared with soldering by vacuum reflow. Lead-free solder SAC305 and SN100C were selected and used in this work since they …
-
Design, Fabrication, and Packaging of Gallium Oxide Schottky Barrier Diodes
… Ga2O3 SBDs are fabricated and packaged using silver sintering as the die attach. The sintered silver joint has higher thermal conductivity and better reliability as compared to the solder joint. The metal finish on the anode and cathode has been optimized for silver sintering. Large-area, …
-
Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection
… of low-temperature sintering of nanoscale silver pastes. The nanoscale silver pastes have been formulated by adding organic components (dispersant, binder and thinner) into nano-silver particles. The selected organic components have the nano-particle polymeric stabilization, paste …
-
Design, Fabrication, Characterization, and Packaging of Gallium Oxide Power Diodes
… large-area Ga2O3 diodes are packaged using silver sintering as the die attach. The sintered silver joint has higher thermal conductivity (kT) and better reliability as compared to the solder joint. Due to the low kT of Ga2O3 material, junction-side-cooled (JSC) packaging configuration is …