Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 4 of 4 for “"Silicon interposer"”.
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Power distribution network modeling and microfluidic cooling for high-performance computing systems
A silicon interposer platform with microfluidic cooling is proposed for high-performance computing systems. The key components and technologies for the proposed platform, including electrical and fluidic microbumps, microfluidic vias and heat sinks, and simultaneous flip-chip bonding of the …
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Integrated Voltage Regulators with Thin-Film Magnetic Power Inductors
… necessary to drive the power inductors. A silicon interposer is designed and fabricated in collaboration with IBM Research to integrate custom power inductors by 2.5D chip stacking, enabling power conversion with current density greater than 10A/mm2. The concepts and designs developed from …
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Graphene Nanotechnology the Next Generation Logic, Memory and 3D Integrated Circuits
… at a reduced voltage compared to conventional silicon based floating gate devices. We have presented detail analysis of the operation and the programming and erasing processes of the proposed FGT, dependency of the programming and erasing current density on different parameters, impact of …
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3D modeling and integration of current and future interconnect technologies
… 10% of Ansys Q3D extracted values. Through silicon via (TSV) is one of the key components of the emerging 3D ICs. However, increasing number of TSVs in smaller silicon area leads to some severe negative impacts on the performance of the 3D IC. Growing signal integrity issues in TSVs is one …